Introduction:
The MPS200T 8-inch rapid probe station is an integrated wafer testing solution designed for power devices, optoelectronic devices, and RF device wafer testing. It offers DC IV, CV, TLP, and RF measurement capabilities. It features a quick guide rail movement for 8-inch stroke, magnetic吸附locking, and precise differential gauge positioning for each wafer's die location. The probe station's chuck platform is nickel-plated to ensure low contact resistance during testing, as well as handling ultra-thin wafer slices and power dissipation. It also provides low leakage noise protection and shielding environment.
Application Scenario: Wafer Testing for Components (RF Components, Optical Components, Power Devices)
Feature:
Wafer Test Capabilities: DC, optoelectronic, and RF parameter testing
Wafer Stage Surface: Gold-plated treatment to ensure the lowest contact resistance between the wafer surface and the stage.
Safe Operation: Interlock mechanisms ensure operator safety during testing procedures.
XY Motion: Fast sliding track drive, electromagnetic locking, precise micrometer adjustment
Signal Connection: The Signal Transfer Kit, paired with Keysight analytical testing instruments, simplifies and accelerates the setup of the testing system.
Configuration:
MPS200T: Probe Station Main Unit
Microscope: Monocular body microscope with lens
Probe: DC probe, optical probe, RF probe
Electromagnetic Shielding: Custom Electromagnetic Shielding Boxes
Probe Holder: Precision magnetic suction micrometer probe holder, displacement resolution 1um
Technical Specifications:
8-inch Manual Probe Stage Main Unit
Testable Wafer Sizes: 2 inches to 8 inches, fragments, single chip, RF chip
Chuck Plate XY Travel: 230mm x 270mm, Slide Rail Movement, Micrometer XY Fine Adjustment, Resolution 1μm
2) Chuck plate movement: Rapid sliding XY worktable, quick push-pull movement, electromagnetic XY locking, micrometer fine adjustment.
3) Chuck disk angle adjustment: coarse adjustment 360°, fine adjustment ±5°, operated by a micrometer head knob; with rotating locking mechanism
4) Chuck disc Z-axis travel: 10mm
5) Probe Table: Maximum travel 30mm, adjustable; overall piercing, lifting needle;
6) Surface Material: Chuck plate with super-hard aluminum surface, nickel or gold plating (optional); Probe Stage Material: Stainless steel surface with nickel plating
7) Equipment Weight: Approximately 200 KG
8) Vibration Damping Conditions: Silicone Isolation
