Feature Introduction

The DB100S is a manual-hybrid micro assembly SMT system. The entire machine is equipped with a marble motion platform, ensuring the overall motion accuracy reaches the sub-micron level. It comes with an integrated laser height measurement system, capable of meeting the requirements for deep cavity substrate assembly and eutectic welding. Optional modules include nozzle heating, nozzle pressure feedback system, UV dispensing and curing module, nitrogen protection gas module, substrate preheating module, process monitoring module, and chip flip-chip assembly module.

The system's soldering accuracy can reach 1um depending on the configuration and can manually change the nozzles for different-sized chips. It is an essential equipment for high-precision bonding in various applications such as high-end medical devices (core imaging module assembly), optical devices (laser diode LD, VCSEL, PD, LENS assembly), semiconductor chips (MEMS devices, RF devices, microwave devices, and hybrid circuits), etc. It is particularly suitable for research institutions, universities, and corporate laboratories for R&D and small-batch, multi-product production needs. The product offers high precision, stable performance, and excellent value for money. The operation is very convenient, making it especially suitable for high-precision chip assembly.

【Standard Equipment】1. SMT System 2. Vision Calibration System (for systematic inspection and calibration of the precision of mounted chips) 3. Laser Ranging System 4. Gluing System 5. High-Precision Vision Alignment System 6. Servo Motion Control System

【Accessories】1. Top Nozzle Heating Module 2. Nozzle Pressure Feedback System 3. Adhesive Application and UV Curing Module 4. Nitrogen Protection Gas Module 5. Substrate Preheating Module 6. Eutectic Platform 7. Chip Flip-Chip Mounting Module