Feature Introduction

VRO945 online vacuum reflux furnace, featuring high output, low energy consumption, and low nitrogen consumption.

VRO945 is specifically designed and optimized for the vacuum welding encapsulation of lead frame products for the semiconductor industry and the vacuum welding encapsulation of CLIP products, addressing the unique needs of these special applications. Taking into account the numerous issues faced by industry clients, it is a meticulously optimized vacuum reflow oven.

Low Oxygen Content: Oxygen content less than 10ppm.

Low energy consumption: Starting power of the whole machine: 18KW; Average operating power of the whole machine: 6KW

Low nitrogen consumption: Only 1/3 of the nitrogen consumption compared to other similar vacuum furnace products.

4). Compact land area: Dimensions: 1900*1000*1300mm

Product Features

Meets the welding requirements for various solders (≤450°C)

For example: SAC305 solder paste; Sn63Pb37 solder paste; Sn90Sb10 solder paste; In97Ag3 solder paste; In52Sn48 solder paste, and various other composition solder pastes.

VRO945 Welding Porosity Rate: Solder pad porosity <2%. Individual porosity: 1%. Different welding materials and atmospheres affect the welding process. The current data is a comprehensive result based on customer testing. The specific data for different welding products may vary.

The VRO945 supports a nitrogen atmosphere working environment and meets various welding processes.

VRO945 Vacuum Recirculating Furnace Configuration Software Control System, modular design setup, user-friendly interface.

The equipment requires no calibration, thus no additional calibration fees will be incurred.