Feature Introduction

The V8S/V8H online vacuum welding furnace features low vacuum degree, high output, low energy consumption, low nitrogen consumption, and small footprint.

2. The V8S/V8H is specially designed and optimized for the vacuum welding encapsulation needs of lead frame products for the semiconductor industry, LED products, and power devices. Considering the various issues faced by industry clients, this is a vacuum furnace meticulously designed to address these needs.

Product Features

Meets welding requirements for various solders (≤450℃)

For example: SAC305 solder paste; Sn63Pb37 solder paste; Sn90Sb10 solder paste; In97Ag3 solder paste; In52Sn48 solder paste, and various other compositions of solder paste.

V8S/V8H Welding Porosity Rate: Solder pad porosity <2%. Individual porosity: 2%. Different welding materials and atmospheres affect welding. The current data is a comprehensive result based on customer testing. The specific data for different welding products may vary.

V8S/V8H supports nitrogen atmosphere working environment, catering to various welding processes.

V8S/V8H Vacuum Reflow Soldering Machine with Software Control System, modular design setup, and an easy-to-understand operating interface.

The equipment requires no calibration, thus incurring no additional calibration costs.