Feature Introduction
1. Suited for chip mounting in semiconductor integrated circuit manufacturing processes (backend packaging), featuring point gluing, dipping glue, bonding, chip placement, wafer bonding, flip-chip, GaAs, programmable bonding pressure control with high precision.
2. Utilizes a precision magnetic levitation motion platform with a contactless, frictionless magnetic levitation system for the main X and Y axes, featuring high-resolution linear encoders. The encoder accuracy reaches 0.02μm, enabling high-speed, precise, sub-micron positioning.
3. The platform design incorporates a high-stability granite integrated high-speed motion platform, allowing the T8W to achieve both thermal and mechanical stability while providing rapid start-up times and +/-0.5μm, or better, placement accuracy, thereby meeting the requirements of high-precision applications.
4. Equipped with an independent dispensing control software for arbitrary setting of adhesive shape and path, enabling the dispensing of dots, lines, planes, non-planar shapes, arcs, circles, and other arbitrary shapes. Additionally, an independent dispensing controller is configured. The dispensing controller features its own algorithm, which automatically increases gas pressure when more adhesive is used, and automatically reduces pressure when less adhesive is used, ensuring consistent dispensing of the adhesive.
5. The image recognition system includes two independent recognition systems. The top system is equipped with two independent industrial cameras to identify PCB MARK points and pads, while the bottom system is fitted with ultra-precise industrial cameras and features over 10 image recognition algorithms, enabling precise identification of related raw materials, including feature points, pins, chip MARK points, non-standard parts, and small substrates.
6. The SMD machine features an automatic calibration function, allowing it to set how many movements to perform before automatically calibrating the X and Y-axis precision. It can also calibrate the motion axis through 3D automatic calibration when the equipment's positioning is found to be inaccurate. Additionally, it performs automatic calibration of the dispensing head and nozzle of the dispensing machine via the bottom image recognition system.
7. Rotation Angle: Equipped with a high-precision DD motor, the device features a 360-degree rotation capability, with a resolution of 0.001 degrees, enabling chip placement at any angle during assembly.
8. Equipped with precision dotting machines, the software allows selection of using dotting 1 or 2, or both dotting 1 and 2 simultaneously. It supports the use of two adhesives at once, as well as dotting with two heads of different diameters concurrently.
【Product Features】
1. Configurable work area
The gate frame design offers ample workspace. The system can retrieve materials from any combination of feed methods, including waffle disks, wafer feeders, and belt feeders. When picking wafers, the system employs a motor-driven, pressure-controlled lifting mechanism to pick thin chips and chips with large aspect ratios, and it can also perform precise compensation. The ink spot recognition and wafer mapping functions ensure that only known good chips are picked up. The 700 square inch work area easily accommodates a variety of feeding and discharging methods.
2. Pressure Control for Assembly
The T8WS features a closed-loop pressure feedback function, enabling it to handle GaAs and InP devices as well as fragile components like MEMS with great precision. The chip placement force can be as low as 100 grams, thus delicate microstructures like air bridges are not damaged. The pressure for each placement is programmed, ensuring that each chip's pickup and placement is conducted under programmed pressure, to help ensure uniformity of solder paste or adhesive layer thickness.
3. Material Conveyance
The T8WS meets the requirements for specialized mass production while offering sufficient flexibility for small batch production. It can be configured for standalone production with a box-to-box material conveying method, or it can be connected to other processing equipment.
4. Advanced Image Locating and Vision System
Advanced vision systems enable rapid detection and positioning of chips within a 360° range, with powerful wafer base point calibration capabilities. This makes calibration possible for chips with high directional requirements, such as MMICs and beam lead diodes. The vision system calibrates and places chips based on the relative positions of wafer base points, chip edges, or previously placed chip feature points. This ensures repeatable precision and accuracy in aligning optical and microwave devices. Boundary recognition or graphical recognition functions are employed to locate chip centers, edges, or critical application features. The rapid positioning feature allows chips like MMICs and lasers to be directly processed without any pre-positioning. Global and local vision calibration functions are applied to embedded wafers and feature code calibration, enabling quick and accurate processing of complex assemblies.
The T8WS visual system features top and bottom cameras with multiple magnification options, equipped with programmable lighting. The T8WS utilizes a bottom camera for the production of flip-chip and other bottom-characteristic components.
5. Programmable multi-color background light illumination
Each camera's ring light and coaxial light intensity is programmable, allowing for the selection of the appropriate light source for chip alignment and recognition. Multi-color background lighting is suitable for a wide range of materials. The programmable RGB light source (optional) provides enhanced capability for processing challenging calibration surfaces, such as gold lines on aluminum oxide ceramics. A robust vision system ensures production isn't halted due to calibration errors.
6. Vacuum Eutectic Welding Feature
The T8WS is available with a vacuum eutectic welding option. It supports various eutectic processes, including gold-silicon, gold-tin, and gold-germanium. Features include a programmable heating eutectic furnace with rapid vacuum, closed-loop, and heating capabilities to meet eutectic process requirements. The heating rate can be programmed for higher eutectic reliability of parts while avoiding thermal shock. The T8WS also supports direct eutectic and reflow welding, with adjustable contact pressure and programmable positive and negative pressure control functions. The temperature can exceed 500°C.
Optional nitrogen protection, hydrogen-nitrogen mixed gas, or formic acid reduction protection can be added to the preheating system to prevent oxidation of workpieces and substrates. The system automatically transfers substrates or chip encapsulation to a vacuum eutectic furnace, completing the vacuum eutectic or vacuum formic acid eutectic function.
In addition to encapsulating high-power devices like amplifiers, the features of T8WS can also be applied to the mass production of optical components for optical equipment, such as eutectic welding on substrates, TO packages, and butterfly packages.
7. Solder Paste Printing and Solder Dots with Laser Distance Measurement
Precision dispensing control unit for dot conductive & insulating epoxy resin, precise solder paste jetting controller, precise laser height measuring instrument, and automatic positioning and cleaning of dispensing tips to ensure high-precision dot dispensing or area filling.
Through high-precision laser height detection, the T8W achieves precise dispensing functionality. Each calibration checks the height of several points with a laser to determine the slope of each dispensing surface.
8. Robust control system and offline programming system
The T8WS Windows-based intuitive graphical user interface simplifies setup and production processes. The software system includes a library of pre-programmed routines for waffle disks and chips, with components that are easy to learn and all base programs are accessible. The XML formatted database simplifies data operations and offline programming. New visual tools such as adjustable target areas, enhanced gain control, filters, and graphical matching enable the visualization of challenging wafer and chip materials. Features like CAD download functionality, advanced calibration programs, automatic program calling based on the incoming tray's QR code, material traceability, and network connectivity mean almost no time is spent on programming, thereby optimizing production efficiency and equipment utilization.
The T8WS control platform achieves smoother and more precise control through a motion system based on bus control and drives for all axes (including conveyors). The computer hardware is configured with a front USB interface for ease of use, featuring backup functionality with dual hard drive drivers to ensure data security, shorter downtime, and faster data recovery.
9. Turnkey Project
TORCH offers a complete solution for encapsulation, including high-speed precision placement machines, silver paste dispensers, solder paste printers, epoxy dispensers, and a range of other products. The SMEMA-compatible interface allows the T8WS to integrate with a variety of equipment, including wired vacuum welding furnaces, to form a turnkey production solution. TORCH's high-reliability systems and localized technical service support commitment mean your equipment will consistently meet production needs.
Other features and parameters
10.1, SMT Speed: 500-1500 UPH
10.2 Inverted Chip Mounting Speed: 300-800 UPH
10.3 Material Supply in Trays or Pans: Accommodates up to 32 2”x2” waffle pans or 10 4”x4” material trays or combined trays.
10.4, Tape Supply: 8mm, 12mm, 16mm, 24mm, 32mm, 44mm, with the capability to install 16 x 8mm feeders.
10.5 Wafer Supply: Supports 8-inch wafers (12-inch optional), equipped with a motor-driven Z-axis pin device and crystal ring, etc.
10.6 Chip Size: As small as 0.15-5mm, with replacement of the nozzle
10.7 Chip Thickness: Chips or焊片with thickness ranging from 0.05 to 2mm
10.8 Vacuum Eutectic Furnace: Up to 500°C, vacuum level varies depending on the vacuum pump option, between 10pa-500pa. The process utilizes an integrated, mature vacuum eutectic furnace software system for control.
10.9 The computer utilizes an industrial-grade industrial control computer, equipped with an i7 processor with a clock speed of not less than 2.0GHz; it has a minimum of 4GB of memory, a minimum of 500GB of hard drive, and comes with two gigabit network ports, as well as two sets of synchronized backup hard drives.
10.10 Data acquisition card is 16-bit, 16-channel, with a sampling rate of 250K.
10.11. Equipment with dotting machine, utilizing the dotting controller to adjust timing, pressure, vacuum suction, and dotting uniformity algorithm together for high-precision dotting.
10.12 Industrial cameras with three sets or more.
10.13 The equipment's loading platform can accommodate over 32 sets of waffle pans.
10.14, The observation window material of the SMT machine is PC antistatic fire-resistant material.
10.15, Store after programming, and achieve automated production by calling the saved program during use.
10.16, Equipped with 3D automatic calibration software, capable of backing up countless versions of the programmed code.
10.17: Each chip can have an independent mounting pressure setting, which is then controlled via software for feedback adjustment.
10.18 The equipment can individually set the movement speeds for zeroing speed, self-check speed, mounting speed, and mounting pressure for the X, Y, Z, and theta axes under different states via software.
10.19: Software-controlled switch for vacuum nozzle
10.20 The equipment is designed with modular construction for easy maintenance, and a complete set of spare parts is provided for both wearable parts and critical components.
10.21 The entire machine is equipped with safety devices, preventing any human hand from reaching inside the machine during normal operation. The hood has an emergency stop protection feature.
