硅片表面形貌测量VIT系列

NEW: Virtual Interface Technology for 3D-IC Metrology:

-TSV profile (depth, bottom CD, tilt, SWA)

-Residue Detection

-RST

-Copper Nail Height

-Bump Height and Cu pillar height

-Edge trim profile

3DIC TSV and BWS TTV硅片表面形貌测量

Film Stress薄膜应力量测仪

FEOL Electrical Characterization 电学特性

Thin wafer metrology 晶圆测量学

Film Adhesion漆膜附着力测试NEW: Virtual Interface Technology for 3D-IC Metrology:

-TSV profile (depth, bottom CD, tilt, SWA)

-Residue Detection

-RST

-Copper Nail Height

-Bump Height and Cu pillar height

-Edge trim profile