Silicon Wafer Surface Morphology Measurement VIT Series
NEW: Virtual Interface Technology for 3D-IC Metrology:
-TSV profile (depth, bottom CD, tilt, SWA)
-Residue Detection
-RST
-Copper Nail Height
-Bump Height and Cu pillar height
-Edge trim profile
3DIC TSV and BWS TTV Silicon Wafer Surface Morphology Measurement
Film Stress Film Tensile Tester
FEOL Electrical Characterization - Electrical Properties
Thin Wafer Metrology
Film Adhesion Testing: NEW - Virtual Interface Technology for 3D-IC Metrology
-TSV profile (depth, bottom CD, tilt, SWA)
-Residue Detection
-RST
-Copper Nail Height
-Bump Height and Cu pillar height
-Edge trim profile
