Brand: Ming Yi Tang Da

Power: AC 220V, 1KW

Shell Opening Parts Shape: Rectangular Shell Opening Parts Size: (4*4) to (50*50) mm Height Less Than 20mm (can be designed separately according to customer requirements)

Z-axis milling depth: 0.05~0.5mm

X-axis milling width: 0~2mm

Contact Supplier: Qingdao Mingyi Tongda Technology Co., Ltd.

Merchant Address: No. 20, Xinying West Road, Shinan District, Qingdao City

KKJ-A Type Integrated Circuit Opening Machine is a specialized equipment jointly developed by our company, the Ocean Instrument and Equipment Research Institute of Shandong Academy of Sciences, and Qingdao University of Science and Technology, specifically designed for removing lids of integrated circuits in metal packaging. It boasts complete intellectual property rights and can replace similar imported equipment.

This equipment features simple operation, ease of mastery, high positioning accuracy, and stable performance, and is suitable for the relevant majors in scientific research institutions and colleges and universities, as well as for semiconductor manufacturers. It is used for opening the encapsulation of devices such as optical devices, optical communication devices, thick film circuits, and laser pumps that are sealed using parallel seam welding technology. The opening process is non-destructive, thus meeting the need for re-encapsulation after maintenance in the research, production, and repair stages of integrated circuits (unless otherwise specified).

The equipment is designed for the special encapsulation process of integrated circuits with metal packaging, utilizing a unique positioning and clamping design method, which fully ensures reliable case opening for tiny components (4*4mm). It employs vacuum suction to prevent machining dust from entering the cavity.

The equipment is equipped with computer PID control, operating smoothly with no vibration or shock.