Plasma-sprayed ceramic high-temperature coatings primarily utilize yttria partially stabilized zirconia (YPSZ) and the series of silicon and aluminum oxides ceramics. These thermal barrier coatings offer excellent high-temperature resistance and low thermal conductivity, along with good resistance to high-temperature gas erosion and thermal shock. They can operate stably under high-temperature conditions of 800°C to 1600°C, serving as a "fire-resistant armor" for the high-temperature alloy matrix, thereby extending the service life of the matrix material.

Application Direction:

1. Heat-resistant components for aero-engines, marine and land-based gas turbines, engine combustion chambers; protective coatings for rocket nozzles, civil internal combustion engines, turbochargers, heat treatment annealing furnaces, etc.

2. High-temperature-resistant protective coatings for graphite products, anti-oxidation coatings for sintering and brazing fixtures in powder metallurgy, etc.

3. Semiconductors, etching machines, and semiconductor component sintering.

Coating Material:

YSZ (ZrO2-Y2O3 7%): Low thermal conductivity, resistant to high-temperature gas erosion.

2. YCZ (ZrO2-Y2O3-CeO2): High resistance to high-temperature oxidation and thermal shock, with catalytic function for organic combustion. Used as a heat-resistant and catalytic coating on the top of internal combustion engine pistons, it can reduce the content of unburned organic substances in the exhaust by over 80%.

3. Al2O3: High resistance to high-temperature corrosion, excellent thermal stability. High reflectivity to light and high-temperature radiation.

4. Molybdenite (Al2O3-SiO2): Resistant to high-temperature corrosion, good acid resistance, and able to withstand slag erosion as well as resist high-temperature flue gas particle erosion.

Yttria (Y2O3): Resistant to plasma corrosion, used in semiconductor silicon wafer etching, with high temperature resistance of 1500-2000 degrees.