Plasma-sprayed ceramic high-temperature coatings primarily utilize yttria partially stabilized zirconia (YPSZ) and a series of silicon and aluminum oxide ceramics. These thermal barrier coatings boast superior high-temperature resistance and low thermal conductivity, along with excellent resistance to high-temperature gas erosion and thermal shock. They can operate stably under high-temperature conditions of 800℃-1600℃, serving as a "fire-resistant armor" for the high-temperature alloy matrix, thereby extending the service life of the matrix material.

Application Direction:

Aerodynamic, marine, and land-based gas turbine heat-exposed components; engine combustion chambers; rocket nozzles, civil internal combustion engines, turbochargers, heat treatment annealing furnaces, and other protective coatings.

2. High-temperature-resistant protective coatings for graphite products, anti-oxidation coatings for sintered powder metallurgy, brazing and other fixtures.

3. Semiconductors, etching machines, and sintered semiconductor components.

Coating Material:

YSZ (ZrO2-Y2O3 7%): Low thermal conductivity, resistant to high-temperature gas erosion.

2. YCZ (ZrO2-Y2O3-CeO2): High resistance to high-temperature oxidation and thermal shock, with a catalytic function for organic combustion. Used as a heat-resistant and catalytic coating on the top of internal combustion engine pistons, it can reduce the content of unburned organic matter in exhaust gases by over 80%.

3. Al2O3: Resists high-temperature corrosion, exhibits good thermal stability. High reflectivity to light and high-temperature radiation.

4. Molybdenite (Al2O3-SiO2): Resistant to high-temperature corrosion, good acid resistance, and able to withstand slag erosion as well as resistance to high-temperature flue gas particle erosion.

Yttria (Y2O3): Resistant to plasma corrosion, used in semiconductor silicon wafer etching, with high-temperature resistance up to 1500-2000 degrees.