Plasma-sprayed ceramic thermal barrier coatings primarily utilize yttria partially stabilized zirconia (YPSZ) and the series of ceramic materials including silicon oxide and aluminum oxide. These coatings exhibit superior high-temperature resistance and low thermal conductivity, along with excellent resistance to high-temperature gas erosion and thermal shock. They can operate stably under high-temperature conditions ranging from 800℃ to 1600℃, serving as a "fire-resistant armor" for high-temperature alloy substrates, thereby extending the service life of the substrate material.

Application Direction:

1. Heat-exchange components for aero-engines, marine and land-based gas turbines, engine combustion chambers; protective coatings for rocket nozzles, civilian internal combustion engines, supercharged turbines, heat treatment annealing furnaces, etc.

2. High-temperature-resistant protective coatings for graphite products, anti-oxidation coatings for sintering and brazing tools in powder metallurgy, etc.

3. Semiconductors, etching machines, and semiconductor component sintering.

Coating Material:

YSZ (ZrO2-Y2O3 7%): Low thermal conductivity, resistant to high-temperature gas erosion.

2. YCZ (ZrO2-Y2O3-CeO2): High resistance to high-temperature oxidation and thermal shock, with catalytic function for organic combustion. Used as a heat-resistant and catalytic coating on the top of internal combustion engine pistons, it can reduce the content of unburned organic compounds in exhaust gases by over 80%.

3. Al2O3: Resistant to high-temperature corrosion and boasts excellent thermal stability. It has a high reflectivity to light and high-temperature radiation.

4. Mica (Al2O3-SiO2): Resists high-temperature corrosion, has good acidity resistance, withstands slag erosion, and is resistant to high-temperature flue gas particle erosion.

Yttria (Y2O3): Resistant to plasma corrosion, used in semiconductor silicon wafer etching, with high-temperature resistance up to 1500-2000 degrees.