Smart Dust-Free Oxygen-Free Oven, High-Temperature Nitrogen-Free PI Furnace, PI Curing Oven
One,Smart Dust-Free Oxygen-Free Drying Oven, High-Temperature Nitrogen-Free PI Oven, PI Curing FurnaceCore Function Orientation
1.1 Process Compatibility Scenarios
✅ Precision Heat Treatment
Electrocolloid curing: Silver adhesive/BCB adhesive/lithography adhesive cured at high temperatures (300-450°C)
Wafer Processing: Annealing Treatment, PI Film Baking (±1℃ fluctuation accuracy)
Ceramic Sintering: Dust-free Drying of Electronic Ceramic Materials (Class 100 Clean Room Environment)
✅ Industry Coverage Matrix
| Core Industries | Typical Application Products | Process Advantages |
|---|---|---|
| Semiconductor manufacturing | Wafers, Touch Screen ITO Glass | Oxygen content ≤ 20ppm, anti-oxidation |
| Display Panel | LED packaging, OLED substrate | Uniformity of temperature ≤ ±1.5%℃ |
| New Energy | Photovoltaic panels, PCB boards | Rapid heating at 15℃/min (custom version) |
II. Technical Parameter System
2.1 Core Configuration Parameters
| Parameter Category | Technical Specifications | Customizable Options |
|---|---|---|
| Casing Structure | Inner Box: SUS304 stainless steel / Outer Box: Cold Rolled Steel Powder Coated | All stainless steel/Blast-proof coating |
| Studio Size | Standard Specifications: 300×500×700mm | Custom Non-Standard Sizes |
| Temperature Control System | RT +50~450°C | Resolution 0.1°C | Fluctuation ≤ ±1°C | 600°C High-Temperature Expansion |
2.2 Environmental Control System
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▶ Cleanliness: Class 100 └ Optional Class 1000 ▶ Oxygen Content Control: ≤10ppm (N₂ displacement system) └ Equipped with online oxygen analyzer ▶ Heat Exchange System: Linear cooling at 4℃/min (above 80℃)
2.3 Smart Operation Module
- Control System
Industrial-grade PLC + HMI touch screen
- Program Scheduling
Supports 30 groups of 999 program settings
- Data Traceability
Six-Point Temperature Logger (Compliant with FDA 21 CFR Part 11)
Section 3: Equipment Model Comparison Table
| Equipment Model | Studio Volume | Applicable Production Scenarios |
|---|---|---|
| JS-GYM040-AI | 0.043m³ | Lab R&D / Small Batch Prototyping |
| JS-GYM090-AI | 0.091m³ | Medium-sized electronic components continuous production |
| JS-GYM125-AI | 0.125m³ | Photovoltaic cell thermal treatment |
| JS-GYM210-AI | 0.210m³ | Wafer Fab Production Workstation |
FourSmart Dust-Free Oxygen-Free Oven, High-Temperature Nitrogen-Free PI Furnace, PI Curing OvenTechnical Highlights Description
Tripartite Precision Control
- Temperature Dimension
PID algorithm + SSR control, achieving ±0.1% overshoot suppression
- Clean Dimension
HEPA+ULPA dual-stage filtration system, particle retention rate ≥ 99.995%
- Oxygen Control Dimension
Nitrogen or vacuum displacement + gas circulation composite system, residual oxygen meets standards
