Photolithographic resist requires another baking process after exposure, which is referred to as "post-exposure bake" (PEB) or simply post-bake or hardening, due to its occurrence after exposure.
Exposure afterPost-bake Precision Heat Plate, Photolithography Bake Plate, PEB Bake Machine, Hardening Film Bake PlateThe purpose of the PEB baking – to enable the photochemical reaction to be fully completed through heating.
For phenolic resin-based photoresists, PEB can diffuse the photosensitizer to eliminate standing wave effects. Moreover, the diffusion distance of the photosensitizer varies with the PEB temperature, resulting in different levels of standing wave elimination. At 110 degrees, the PEB is most effective in eliminating the standing wave effect.
For chemical amplification photoresists, during the post-baking process, light catalyzes the deprotection reaction of the photoresist resin, also known as the deprotection reaction.
Extensive experiments show that the fluctuations in the baking temperature of the curing plate are one of the main factors affecting the uniformity of line width. When setting the after-baking process, the requirement for the uniformity of the heating plate temperature is generally higher than that of the soft baking process.
Post-bake Precision Heat Plate, Photoresist Bake Plate, PEB Bake Machine, Hard Coating Bake Plate Performance
Smart烤胶Machine
Heating Size: 220*220mm ( customizable ), suitable for products with a diameter of Ø200mm (8 inches) or smaller, or 200x200mm square pieces.
Temperature Range: RT ~ 300°C
Temperature Accuracy: 0.1°C
Temperature uniformity: ≤±0.5℃
Electric height adjustment for pin: 0～30mm
Heating Platform Surface: Made of corrosion-resistant hard anodized aluminum.
Control Unit: 7-inch full-color touchscreen, advanced PLC control, capable of automatic lifting and lowering within the set time frame, with scheduling capabilities for sheet retrieval.
Post-baking precision heated plate, photoresist baking platform, PEB baking machine, hardening film baking platform application
Precision thermal plates for curing photoresist, hardening epoxy plastics, mask baking, flexible circuit testing, wearable technology sensor calibration, suitable for use under microscopes and other applications requiring high-precision temperature control. Ideal for pre-baking and curing in semiconductor lithography processes, as well as coating, sintering, and testing of circuit modules.
