Function Introduction

DB100A is a manual semi-automatic silver sintering substrate bonder. The entire machine features a marble motion platform, ensuring the entire motion precision reaches the sub-micron level. It comes with an integrated laser height measurement system, capable of meeting the requirements for deep cavity substrate placement and eutectic welding. Optional modules include nozzle heating, nozzle pressure feedback system, UV dispensing and curing, nitrogen protection gas module, substrate preheating module, process monitoring module, and chip flip-chip bonding module.

Product Features

The system's soldering accuracy can reach 1um depending on the configuration and can manually change the nozzle for different-sized chips. It is an essential equipment for high-precision bonding in industries such as high-end medical devices (core imaging module assembly), optical devices (laser diode lead frame assembly, VCSEL, PD, LENS, etc.), semiconductor chips (MEMS devices, radio frequency devices, microwave devices, and hybrid circuits), etc. It is highly suitable for the research and development, as well as small-volume, multi-type production needs of research institutes, corporate laboratories, and universities. The product boasts high accuracy, stable performance, and excellent cost-effectiveness. It is extremely user-friendly and particularly well-suited for high-precision chip assembly.

【Standard Configuration】

1. Mounting System 2. Vision Calibration System (for systematic inspection and calibration of the accuracy of mounted chips) 3. Laser Distance Measurement System

4. Adhesive Dipping System 5. High-Precision Vision Alignment System 6. Servo Motion Control System

Select Options

1. Top Suction Nozzle Heating Module 2. Suction Pressure Feedback System 3. Adhesive Dispensing and UV Curing Module 4. Nitrogen Protective Gas Module

5. Substrate Preheating Module 6. Eutectic Platform 7. Chip Flip Mounting Module