Feature Introduction

DB100 is a manual-semi-automatic micro assembly SMT system. The entire machine is equipped with a marble motion platform, ensuring the overall motion precision reaches the sub-micron level. It features an integrated laser height measurement system, capable of meeting the requirements for deep cavity substrate assembly and eutectic welding. Optional modules include nozzle heating, nozzle pressure feedback system, UV dispensing and curing, nitrogen protection gas module, substrate preheating module, process monitoring module, and chip flip-chip assembly module.

The system's pick-and-place accuracy can reach 1um depending on the configuration, and the suction nozzles can be manually changed for different-sized chips. It is an essential tool for high-precision bonding applications in the assembly of advanced medical equipment (core imaging module), optical devices (laser diode lead frames, VCSELs, PDs, LENSES, etc.), semiconductor chips (MEMS devices, RF devices, microwave devices, and hybrid circuits), and other high-precision bonding tasks. It is particularly suitable for the research and development, as well as small batch, diverse product production needs of research institutes, universities, and corporate laboratories. The product boasts high accuracy, stable performance, and excellent value for money. The operation is very convenient, making it especially suitable for high-precision chip assembly.

Standard Equipment: 1. Assembly System 2. Visual Calibration System (for systematic inspection and calibration of the accuracy of assembled chips) 3. Laser Distance Measurement System 4. Glue Application System 5. High-Precision Visual Alignment System 6. Servo Motion Control System

【Optional Accessories】1. Top Nozzle Heating Module 2. Nozzle Pressure Feedback System 3. Solder Paste and UV Curing Module 4. Nitrogen Protection Gas Module 5. Substrate Preheating Module 6. Eutectic Platform 7. Chip Flip Mounting Module