TCB350 (Hot Pressing Bonding) Hot Pressing Bonding Machine

TCB hot bonding is an evolution of the standard flip-chip process, primarily for the thermal bonding of chip-to-wafer, chip-to-PCB, and other substrate bumps. Currently, the device has achieved hot bonding for large-sized (50/70mm) bare chips. The substrate vacuum吸附 heating unit size is 300*300mm.