1. Vacuum chamber: L400×W400×H450mm (specific dimensions to be confirmed by design), vertical square structure with front and rear doors, the front door opens to the right (with guides for up and down movement), facilitating the retrieval and placement of samples between the coating chamber and the glove box. Made of 1Cr18Ni9Ti stainless steel, argon arc welding.

                        2. Substrate PlatformSliding design, size 120×120mm, rotatable and adjustable; substrate can be heated to 300±1℃ (optional), equipped with a substrate platform guard.

                        3.Vacuum System: Mechanical pump + molecular pump; "Two Low and One High" digital composite vacuum gauge for vacuum measurement；

                        4. LimitedVacuum:～8×10-4Pa ≤ 25min；

6. Metal Sources: 2-4 sets available, with baffles.

7.2-4 groups of束源炉式结构, 0-500 degrees adjustable, equipped with an independent baffle.

8. Film Thickness GaugeThe thickness gauge water-cooled probe is mounted near the wafer stage on the wafer holder. The thickness gauge is used for real-time monitoring of deposition rate and final thickness, with an accuracy of ±0.1A (0.01nm). It features an interlock function with the power supply. During operation, if the deposition reaches the set thickness, the power supply can be automatically cut off to stop the deposition.；

9. Control System:Full SetControl system employsPLC+TouchscreenControlThe machine features both automatic and manual functions, allowing you to input parameters on the touch screen for exploring coating process parameters.