Low-melting point glass powder possesses physical properties such as 3 highs: high adhesion, high thermal conductivity, and high thermal stability, and 2 lows: low thermal expansion coefficient and low melting point. It is used in special sealing welding rods and serves as a sealing material, enabling interconnection, bonding, and insulation between glass, ceramics, metals, semiconductors, and other materials at lower temperatures. Applications include the electrical vacuum and microelectronics industry, automotive, aviation, and aerospace sectors, addressing a range of modern technical challenges such as electrical engineering, electronic sensors, protective and decorative coatings, optics, optical communications, structural mechanics, nuclear technology, superconductors, and microfluidic chips. Low-temperature sealing glass, as a sealing material, also facilitates interconnection, bonding, and insulation between glass, ceramics, metals, and semiconductors at lower temperatures, and is used in the same industries to solve various modern technical issues.