Nano-spherical in appearance, the amorphous white powder has particle sizes ranging from 100 to 500 nanometers, with a microstructure that is spherical and features a quasi-particle structure of fluffy and network-like. Nano-spherical二氧化硅 has a wide range of applications; for instance, making polishing wax from nano-spherical silicon dioxide can improve the surface smoothness of materials. High-purity nano-spherical silicon dioxide for grinding is used in optical devices and the optoelectronics industry, particularly suitable for grinding and polishing semiconductor single-crystal and polycrystalline silicon wafers, picture tube glass shells and screens, optical glass, liquid crystal display (LCD, LED) glass substrates, InGaN, compound semiconductor materials (InP), magnetic materials, and other semiconductor industry applications.
Polishing powder, made from ultra-fine, graded ultra-micronized particles, is an excellent polishing and cleaning abrasive for metal parts. When used in cleaning bearings, it can achieve a finish of 3.0 or better, surpassing similar products. Additionally, it excels in polishing metal surfaces, valves, and automotive polishes, delivering exceptional results. Its spherical particle shape distinguishes it from the traditional isometric abrasive shape, allowing the abrasive particles to produce a sliding polishing effect on the workpiece surface during grinding, rather than the traditional abrasive grinding that can cause random scratches. Moreover, since the grinding pressure is evenly distributed over the abrasive particles, particle fracturing is reduced, and wear is significantly decreased, thus enhancing the grinding efficiency and surface finish. Experiments show that the abrasive powder can reduce the number of grinding and polishing steps by at least 10-20%, enabling rapid grinding and polishing.
Polished silica sol for CMP, utilizing high-purity spherical silicon dioxide, is mainly used for polishing silicon wafer slices, adjusting CMP slurries for integrated circuits, and surface chemical mechanical polishing (CMP) processing on various sizes of Si, Ge, GaAs wafers, ILD and conductors in integrated circuits, quartz glass, hard disk substrates, IC circuits, optoelectronic crystal materials, LED sapphire substrate materials, and other surfaces. Particularly suitable for single-step polishing.
