Fired-resistant, heat-resistant, and hardened high-purity spherical nanoparticles are produced through a special nanotechnology process based on the chemical properties of different matrix materials. These nanoparticles exhibit excellent compatibility with the matrix resin, allowing for even dispersion within the resin and forming a tight bond with the polymer system, enhancing the properties of the polymer material.
Product Features
Good interfacial compatibility with resins – anti-settling, enhancing the mechanical properties of composite materials affected by high fillers.
2. Special surface treatment, powder self-flowing – facilitates dispersion under shearing action, reduces the viscosity of the resin blend, and optimizes processing properties.
3. High thermal resistance, low coefficient of thermal expansion—Reduces the thermal expansion coefficient and curing shrinkage of composite materials, enhances the thermal deformation temperature of polymers and dimensional stability of products, mitigates stress concentration within the composite, and improves mechanical properties.
4. Excellent electrical insulation – The fluidized bed purification process significantly reduces the content of impurity ions, resulting in the composite material having good insulation and arc resistance properties, and lowering the moisture absorption rate of the cured material.
5. High Hardness – Coatings produced with spherical nano-silicon dioxide additives significantly enhance the hardness and scratch resistance of the coating, offering up to 2-3 times the improvement over traditional coatings.
6. Weather and Migration Resistance – Possesses complete chemical inertness, remains unchanged or does not induce deterioration in the presence of catalysts or in multi-component systems, and does not decompose.
Particle Size nm: 100 SiO2 Content: 99.99%
Application Scope
Electronic components, adhesives, powder coatings, ultra-hard coatings, functional insulating coatings, corrosion-resistant coatings, special paints and inks, silicone rubber (mold胶, handle胶, keypad胶, etc.), copper-clad boards, electronic potting compounds, epoxy resin casting materials, plastic sealing materials, LED encapsulation materials, high-heat-resistant resins, and various functional high polymer products.
User Instructions
1. Selection should be based on the performance requirements of the product when used alone. Particle size is closely related to the properties of the composite material; the smaller the particle size, the finer the surface texture and the better the effect. However, the viscosity is also greater during blending, so please carefully adjust the formula to balance all properties.
2. Mixed fillers with different particle sizes can form a dense packing within the polymer system at the appropriate ratio. A rational blending system can prevent the settling or floating of the fillers, while also reducing the viscosity of the resin blend under equal amounts of filling, which is beneficial for shear dispersion.
3. Refined silicon dioxide has an increased surface area, tends to agglomerate, has poor compatibility with polymers, is difficult to disperse evenly, and affects the physical properties of composites. Thermally stable, toughened, and amorphous silicon dioxide has good interfacial compatibility with high polymers. The surface coating can form bond reactions with the resin matrix groups, reduce the viscosity of the blend, eliminate stress concentration at the interface, and improve the mechanical properties of the composite. Due to the different surface groups of different product models, there may be slight differences in their applicability in the resin system.
4. Recommend determining the addition amount through testing.
