Microfocus X-ray Inspection System

This system is a high-tech product integrating modern computer software technology, precision mechanical manufacturing technology, optical technology, electronic technology, sensor technology, non-destructive testing technology, and image processing technology. It is an effective means for product research, failure analysis, high-reliability screening, quality evaluation, process improvement, and other tasks.

Applicable Range

● Suitable for BGA, CSP, and Flip Chip inspection

PCB board welding condition inspection

● Various battery testing

IC Packaging Inspection

● Capacitors, resistors, and other electronic components

● Internal Defects in Metal and Medium Materials

● Internal structure and components of lightweight materials

●Electric heating tubes, pearls, precision components, etc.

Image Processing System Main Functions

●Virtual 3D imaging, real-time zoom in and out

●Gray-scale optimization, real-time pseudo-color, user-friendly design

● Electronic imaging, multi-frame stacking, quick and convenient

Supports positive/negative images, edge enhancement available

● Precise curvature measurement and statistics

Advanced measuring tools

● BGA ball measurement technology

● Angle, radius, weld point area, and bubble area measurements; bubble proportion calculation; weld point coordinate location and statistics

● Dynamic Storage; Multiple Output Methods: Storage, Printing, and DVD Read/Write

Key Parameters

Micro-focus X-ray source

● Tube voltage adjustment range: 20～160kV

● Current Regulation Range: 0.1μA ~ 1000μA

● Focal Sizes: 1μm, 5μm, 30μm

● JIMA resolution: 0.5μm ~ 2μm

● Magnification: 20x to 3000x

●The testing platform can move along the X-Y-Z multi-axis.

Inspection Case