Desktop Oxygen-Free Oven, Experimental High-Temperature Oxygen-Free Curing Furnace, Vacuum Oxygen-Free Oven

A benchtop anaerobic curing oven is a compact curing unit specifically designed for high-precision electronic components, ICs/chips, PI/BCB/CPI/BPO adhesives, and other materials. It combines anaerobic conditions with efficient heating technology to ensure that materials are protected from oxidation during the curing process. Below is comprehensive information on the related products:

1. Benchtop Oxygen-Free Oven, Experimental High-Temperature Oxygen-Free Curing Furnace, Vacuum Oxygen-Free Oven Types and Features

1. Vacuum Oxygen-Free Curing Furnace

2. Utilizing vacuum environment and nitrogen inflation technology to ensure anaerobic conditions, suitable for curing high-precision materials such as PI adhesive and BCB adhesive.

3. Supports PLC full automatic control, temperature range exceeds 400°C, inner tank made of SUS304/316 stainless steel, ensuring cleanliness and durability.
   

4. Intelligent Oxygen-Free Drying Oven

5. Integrated intelligent oven management system, supporting TCP/IP protocol for interfacing with factory systems, enabling automated baking.

6. High cleanliness grade, oxygen content can be controlled below 10ppm, suitable for dust-free environments such as IC wafers, MEMS, etc.
   

7. Small desktop unit

8. Compact design, for experimental use only.

   Low nitrogen usage, lower gas consumption, no need for cooling water.

II. Core Parameters and Configurations

• ‌Applicable Products: 1-8 inch wafers, slices, or fragments

• Temperature Control: RT+50–400℃

• Temperature Fluctuation: ≤±1℃
  

• Oxygen Content: Oxygen levels can go as low as below 10ppm, equipped with an imported oxygen content analyzer for real-time monitoring.

• Rise Rate: 1-10℃/min, adjustable speed

• Heating Methods: Multi-step programmable, supporting 20 heating programs

• Cooling Rate: Auxiliary Cooling

• Vacuum Level: ≤ 1 torr
  

• Gas System: Automatic Nitrogen Filling Valve + Adjustable Flowmeter

• Exhaust Port: KF16
  Vacuum Pumps: Spiral Dry Pump (Import)
  

• Structure Design: Interior made of high-quality stainless steel, fully welded with argon arc welding for seamless finish, exterior case insulated with ultra-fine ceramic fiber material.

Operation Interface: Human-Machine Interface + PLC, one-touch operation, multiple process editing

3. Benchtop Oxygen-Free Oven, Experimental High-Temperature Oxygen-Free Curing Furnace, Typical Application Scenarios for Vacuum Oxygen-Free Ovens

• ‌Electronic Manufacturing: IC packaging, wafer bonding, fingerprint recognition modules, etc., with adhesive curing under anaerobic conditions.

• Precision Materials: Vacuum oxygen-free curing of PI adhesive, BCB adhesive, and conductive adhesive to prevent performance degradation caused by oxidation.

• ‌Lab R&D: Compact desktop units ideal for handling small batches of samples, with quick drying capabilities.

Desktop Oxygen-Free Oven, Supplier of Experimental High-Temperature Oxygen-Free Curing Furnace - Shanghai Junsi Instrument