Post-exposure nitrogen drying oven PEB dust-free oven High-temperature hot nitrogen drying oven Cleanroom drying oven application process
The high temperature (100-130°C) used in the dust-free oven causes photosensitive compounds to diffuse, thereby eliminating standing wave ripples. It features a 100-class cleanroom environment, specifically designed for semiconductors and integrated circuits.
A method to reduce standing wave effects is called Post Exposure Bake (PEB). The high temperatures (100-130°C) used cause photo-sensitive compounds to diffuse, thereby eliminating standing wave ripples. It is important to note that the harmful effects of high temperatures on photoresists, such as the PAB mentioned above, also apply to PEB. Therefore, optimizing baking conditions becomes crucial. Additionally, the diffusion rate of the exposed product depends on the PAB conditions - the presence of solvents can enhance the diffusion during the PEB process. Therefore, a low-temperature post-exposure bake can produce greater diffusion at a given PEB temperature.
For conventional photoresists, the primary significance of PEB lies in the elimination of standing wave diffraction. In the case of photoresists known as chemically amplified photoresists, PEB is a necessary component of the chemical reaction that produces the difference in solubility between exposed and unexposed photoresist areas. For these photoresists, exposure creates a small amount of strength that itself does not alter the solubility of the photoresist. During the post-exposure baking, this exposure catalyzes a reaction that changes the solubility of the polymer resin in the photoresist. For chemically amplified photoresists, PEB control is extremely critical.
Post-exposure nitrogen drying oven PEB dust-free drying oven High-temperature hot nitrogen drying oven Clean drying oven performance
Cleanliness: Class 100
Temperature: RT+15 to 300℃
Process Gas: N2
Timer Function: 0-99H 99M 99S
Material: Interior SUS304 stainless steel
Working Dimensions (mm):
450×450×450(4)
500×500×550(6)
600×600×700(8)
( customizable )
Mold Plates: 2 movable pieces
Post-exposure nitrogen drying oven PEB dust-free drying oven High-temperature hot nitrogen drying oven Cleanroom drying ovenApplicability:
Nitrogen drying ovens are also suitable for IC packaging, photoresist curing, silver adhesive curing, electronic liquid crystal display, LCD, CMOS, MEMS, and laboratory production and scientific research.
