Clean Oxygen-Free Oven, Nitrogen Oxygen-Free Oven, High-Temperature Anaerobic Oven, Dust-Free Oxygen-Free Oven Technology

Electronic-grade PI (polyimide) film finds its main applications in the semiconductor and microelectronics industries in the following aspects:

Particle遮挡膜: High-purity polyimide coated filmIt is an effective shielding material that resists radiation and particles.

2. Passivation layer and buffer inner coating for microelectronic devices

Polyimide is widely used as a passivation layer and buffering protective layer in the microelectronics industry. PI coatings effectively block electron migration and prevent corrosion. Components protected by the PI layer have extremely low leakage currents.Enhances the mechanical properties of components, prevents chemical corrosion, and effectively increases the moisture resistance of electronic components. PI film has buffering capabilities, which can effectively reduce circuit cracking and open circuits caused by thermal stress, minimizing damage to components during subsequent processing, packaging, and post-processing.

3. Layer-to-layer dielectric materials for multilayer metal interconnect circuits: Polyimide (Junsen PI Oxygen-free Oven) materials (mainly in the form of PI film) can serve as dielectric materials between layers in multilayer wiring technology for multilayer metal interconnect structures. Multilayer wiring technologyIt is the key technology for developing and manufacturing ultra-large-scale high-density, high-speed integrated circuits with a three-dimensional stereoscopic cross structure.

4. Key material for optoelectronic printed circuit boards: The refractive index of polyimide can be adjusted by modifying the fluorine content of the copolymer. The higher the fluorine content, the lower the refractive index of the fluorinated polyimide film, thereby regulating the size of the refractive index. Hence, both the core layer and cladding of the waveguide can utilize polyimide.

Clean Oxygen-Free Oven, Nitrogen Oxygen-Free Oven, High-Temperature Anaerobic Oven, Dust-Free Oxygen-Free Oven Performance

Temperature Range: RT+20～450℃

Uniformity of temperature: ≤±1.5%℃

Rising Speed: 0-8°C/min

Oxygen Concentration: ≤20ppm

Work Size: Compatible with 2-12 inch wafers and squares; customizable sizes available.

Power: AC 380V/50Hz

Operation Method: Human-Machine Interface + PLC, Automatic Control, Programmed Operation

Inlet: φ10mm N2 inlet, flowmeter control/adjustable

Method of Heating: Step-by-Step Heating

Cooling Function: Water Cooling + Air Cooling

Clean Oxygen-Free Oven, Nitrogen Oxygen-Free Oven, High-Temperature Anaerobic Oven, Dust-Free Oxygen-Free Oven Applications

Oxygen-free ovens are used in industries such as touch screens, wafers, LEDs, PCB boards, ITO glass, and precision electronics, solar energy, and new materials. They are ideal for mass production of semiconductor wafers, semiconductor packaging, and MEMS devices. Primarily used for PI/CPI curing, BCB curing, PBO curing, and LCP fiber heat treatment.