MSD Oven, 90°C 5% Dry Oven, High Temperature Ultra-Low Humidity Oven, Moisture-Sensitive Component Oven Development Background

IPC/JEDEC J-STD-033 Standard for Handling, Packaging, Shipping, Storage, and Use of Moisture/Reflow Sensitive SMDs. This document provides recommended methods for handling, packaging, shipping, and drying moisture-sensitive components. Dry packaging involves sealing moisture-sensitive components with desiccant, humidity indicator cards, and moisture-sensitive caution labels inside a moisture-proof bag. The labels contain information regarding shelf life within specific temperature and humidity ranges, peak package temperature (220°C or 235°C), exposure time after opening the bag, detailed instructions on when baking is required, baking procedures, and the sealing date of the bag.

Currently, due to reasons such as aging from baking at 125°C and damage to components with moisture content exceeding 0.1wt% upon baking, it is recommended to use baking conditions of 40°C + 5%RH or 90°C + 5%RH.

 MSD Oven, 90°C 5% Low Humidity Oven, High Temperature Ultra-Low Humidity Oven, Moisture-Sensitive Component Oven, Baking in Two Methods：

A. Baking Moisture Removal  Baking is a complex process.

B. Dehumidification for ambient temperature drying chamber.

Temperature Range: RT (Room Temperature) +15～200℃

Humidity Range: Normal humidity ~ 5%RH below

Dehumidification Time: ≤15min

Uniformity: ±1.5℃，±3%RH

Working dimensions: W600×H800×D600mm

Heating Method: The worm gear hot air circulation system ensures even circulation of internal heat air

Dehumidification Method: Fast Ultra-Low Humidity Dehumidification Without Consumables

Operation Interface: Color Touch Human-Machine Interface