PI Vacuum Curing Oven  Water-Cooled PI Curing Furnace  Oxygen-Free Oven  Features of Dust-Free Oxygen-Free Oven

PI curing ovens are used for processes such as photoresist BCB, polyimide PI curing, wafer drying and baking, primarily for industries related to integrated circuits, compound semiconductors, MEMS microelectromechanical systems, and TFT/LCDs.

Versatility, fully automatic vacuum curing, compatible with 2" to 12" fragments.

Highly reliable, achieving vacuum curing under 5PPM oxygen content.

Timeliness, multi-functional cooling methods, reduced process time, cost reduction, and increased production capacity.

Low energy consumption, vacuum curing, saving 80% of N₂.

Non-toxic; all internal materials of the cavity are made of 316L stainless steel, no particles are produced.

PI Vacuum Curing Oven  Water-Cooled PI Curing Furnace  Oxygen-Free Oven  Oxygen-Free Dust-Free Oven Performance

Temperature: MAX 400°C

Vacuum Level: Below 100 Pa

Operation: Colorful human-machine interface, one-touch operation

Cooling Method: Water Cooling + Air Cooling

Air Path: 1 Route N2

Program Mode: 10 programs running, each with 25 steps adjustable

Insulating Material: Ceramic Fiber

Operation mode: 1/2/4/8 options available

Oxygen-free drying ovens (BCB curing furnaces), vacuum oxygen-free drying ovens (PI curing furnaces), dust-free drying ovens, HMDS drying ovens, sputtering machines, dust-free and oxygen-free drying ovens, nitrogen drying ovens, blowing vacuum drying ovens, high-precision heated plates, ultra-low temperature test chambers, rapid temperature change test chambers, constant temperature and humidity test chambers, high and low temperature shock test chambers, and other equipment, as well as customized non-standard products. --- Shanghai Junsi Instrumentation specializes in production/services