High-Temperature Vacuum Oxygen-Free Oven JS-GYZF040 Junsi Oxygen-Free Oven High-Temperature Oxygen-Free Curing FurnaceApplication
The Junsen Oxygen-Free Oven is used for curing photoresists like PI/BCB/LCP/PBO, anaerobic baking, MEMS manufacturing, and high-temperature annealing processes. It is suitable for R&D and production in the semiconductor, electronics, and new materials industries. Commonly used in research institutions, university laboratories, and factory production lines.
Passivated layers and buffer inner coatings for microelectronic devices, interlayer dielectric materials for multilayer metal interconnect circuits, and base materials for photovoltaic printed circuit boards.
BCB is a high-performance material with excellent thermal stability, chemical stability, electrical insulation, and mechanical strength. It has very important applications in modern high-tech fields. For example, in the manufacturing of microelectronics, it is used for钝ization protection and interlayer dielectric in various devices.
PBO chemical fiber is a high-performance chemical fiber made from PBO polymer through liquid crystal spinning. It boasts unique properties in terms of strength, specific modulus, heat resistance, and flame retardancy.
Liquid Crystal Polymer (LCP) refers to high polymers that can exist in a liquid crystalline state under certain conditions, characterized by molecules with high molecular weight and oriented order. LCP boasts excellent properties and low dielectric loss, and is poised to accelerate its application in 5G high-frequency signal transmission.
High-Temperature Vacuum Oxygen-Free Oven JS-GYZF040, Junsi Oxygen-Free Oven, High-Temperature Oxygen-Free Curing Furnace Specifications
Step-by-Step Process for Oxygen-Free Oven Curing
Internal equipment reaches a low-oxygen vacuum state
Low-temperature preheating
2. Linearly increase to the medium temperature stage
3. Constant temperature phase at medium temperature
Linearly increase to the high-temperature stage
5. Constant temperature during high-temperature phase
6. Temperature Reduction
Performance requirements for anaerobic curing equipment:
Temperature Range: RT+30～350℃
Ramp-up Rate: 0-5°C/min, linear ramp-up
Cooling Method: Auxiliary Cooling
Nitrogen Control: Nitrogen Flow Regulated
Oxygen Content Testing: Real-time oxygen concentration detection, less than 50ppm
Working Dimensions: W350×H350×D350, Customizable
Vacuum Level: Up to 1 torr
Vacuum Pump: Oil-Free Pump
High-Temperature Vacuum Oxygen-Free Oven JS-GYZF040, Junsi Oxygen-Free Oven, High-Temperature Oxygen-Free Curing Furnace Manufacturer
