Cleanroom Oxygen-Free Oven PI/BCB/PBO Oxygen-Free Oven High-Temperature Anaerobic Oven Application in Wafer-Level Packaging Process
Wafer-Level Packaging Process Flow
1. Coating polymer film to reinforce the chip's passivation layer, serving as a stress buffer. Polymer types include photosensitive polyimide (PI), benzocyclobutene (BCB), and polybenzoxazole (PBO).
2. The Reballing Dielectric Layer (RDL) involves repositioning the aluminum/copper bonding areas on the chip to meet the minimum spacing requirements for solder ball placement and to arrange the new bonding areas in an array pattern. Photoresist acts as a template for selective electroplating to plan the RDL's routing patterns, and is eventually removed along with the sputtering layer through wet etching.
3. Apply the second layer of polymer film to flatten the wafer surface and protect the RDL layer. Photolithographically define new soldering area locations on the second layer polymer film.
4. The Under-Bump Metal (UBM) features the same process flow as the RDL.
5. Solder Ball Placement. Solder paste and solder balls are accurately positioned via a mask. The solder balls are placed on the UBM and then inserted into a reflow oven. The solder melts and wets well with the UBM, achieving excellent welding results.
A dust-free and oxygen-free oven is essential production equipment during the curing process of PI/BCB/PBO polymer in the above polymer film technology.
Cleanroom Oxygen-Free Oven PI/BCB/PBO Oxygen-Free Oven Technical Requirements for High-Temperature Anaerobic Oven
Temperature Range: RT+50 ~ 350/450/550°C
Studio Size (cm): W50×D50×H50; Customizable
Oxygen content specification: ≤ 50ppm, real-time detection
Cleanliness: Class 100/1000
Thermal Control Method: Curve Heating Mode
Temperature Control Sections: Multi-section, multi-process
Nitrogen Control: Adjustable nitrogen flowmeter, continuous nitrogen supply.
Auxiliary Cooling: Air-cooled/Water-cooled rapid cooling devices
Vacuum Dust-Free Oxygen-Free Drying Oven
Temperature Range: RT+50 to 350/450/550°C
Studio Size (cm): W50×D50×H50; Customizable
Oxygen Content Specification: ≤ 50ppm, Real-time Detection
Cleanliness: Class 100/1000
Temperature Control Method: Curve Heating Mode
Temperature Control Sections: Multiple stages, various processes.
Nitrogen Control: Adjustable nitrogen flow meter, continuous nitrogen supply.
Auxiliary Cooling: Air-cooled/Water-cooled rapid cooling devices
Vacuum Level: 1 torr
Vacuum Pump: Oil-Free Scroll Pump
Cleanroom Oxygen-Free Oven PI/BCB/PBO Oxygen-Free Oven High-Temperature Anaerobic Oven
