Anaerobic Oven, High-Temperature Oxidation-Free Oven, PI Vacuum Anaerobic Oven, BCB OvenApplicable Process:

     High-Temperature Oxidation-Free Drying OvenUsed for PI/BCB/LCP curing, semiconductor packaging, and also for pre-treatment baking, curing, and development of materials such as silicon wafers, niobium lithium, and glass before coating in semiconductor manufacturing.

Oxygen-Free Oven, High-Temperature Oxygen-Free Oven, PI Vacuum Oxygen-Free Oven, BCB OvenTechnical Performance:

Internal cavity size: 350*350*350 (mm)

Temperature Range: RT+30 to 450℃

Temperature fluctuation: ±1℃

Temperature Control Accuracy: 0.1℃

Oxygen Concentration: 10 ppm

Vacuum Degree: 100 Pa

Cooling Method: Rapid Cooling

Operation Method: Human-Machine Interface, one-touch intelligent operation.

Inner Material: Made of #304 mirror-polished stainless steel.

Shell Material: High-quality cold-rolled steel with powder coating.

Replacement Gas: Nitrogen

Power: 380V/50Hz, 5KW

Supporting device: foot cup and swivel wheel.

Manufacturer Brand: Junsi

High-temperature oxygen-free ovens, cleanroom ovens, HMDS vacuum ovens, sputter deposition machines, dust-free oxygen-free ovens, nitrogen ovens, ultra-low temperature test chambers, rapid temperature change test chambers, constant temperature and humidity test chambers, high and low temperature shock test chambers, and more equipment, as well as customized non-standard products. — Shanghai Junsi Instruments, specializing in production and service!