【Features Introduction】

Wafer alignment and bonding are key processes in wafer-level sealing, wafer-level packaging, engineering substrate manufacturing, wafer-level 3D integration, and wafer thinning. These processes have driven remarkable growth in MEMS devices, RF filters, and BSI (backside-illuminated) CIS (CMOS image sensors). Moreover, these processes can also fabricate engineering substrates like SOI (Silicon On Insulator). Popular bonding techniques include adhesive, anodic, direct/melted, glass powder, solder (including eutectic and transient liquid phase), and metal diffusion/thermal compression.

The Torch520 bonding machine is primarily used for the bonding process of 8" (D200mm) wafer chips. This process achieves wafer bonding by applying uniform pressure and precise displacement control at high temperatures. The equipment offers optional processes for product pressure at low vacuum (0.1 mbar) and high vacuum (1E-6 mbar), with pressure up to 60 KN and heating temperature up to 650°C. It meets the cooling and heating rate requirements of 40K/min and can provide positive pressure atmosphere protection at the end of the process, with a pressure of up to 3 bar. The product features an opening and closing design with an upper and lower cavity cover, and the cover is designed to meet ergonomic requirements. The system is equipped with a closed-loop water cooler for rapid cooling. The equipment can optionally use formic acid cleaning before the process.

Standard/Optional

Chamber Count: 1; Temperature Control: Independent temperature control for top and bottom heads; Chamber Opening: Designed with ergonomics in mind, featuring an upward-opening cover; System Operation: Circulating water cooling with a closed-loop water cooling heat exchanger. Optional: Pressure protection; Formic acid atmosphere.