Feature Introduction

Wafer alignment and bonding are key processes in wafer-level packaging, wafer-level packaging, engineering substrate manufacturing, wafer-level 3D integration, and wafer thinning. These processes have driven remarkable growth in MEMS devices, RF filters, and BSI (backside-illuminated) CIS (CMOS image sensors). Additionally, these processes can also produce engineering substrates, such as SOI (Silicon on Insulator). Popular bonding techniques include: adhesives, anodes, direct/melted, glass powder, solder (including eutectic and transient liquid phase), and metal diffusion/pressure bonding.

The Torch520 bonding machine is primarily used for the bonding process of 8" (D200mm) wafer chips. This process achieves wafer bonding by applying uniform pressure and precise displacement control under heat. The equipment offers optional processes for product pressing in low vacuum (0.1 mbar) or high vacuum (1E-6 mbar), with pressure up to 60 KN and heating temperature up to 650°C. It meets the requirements of a 40K/min heating and cooling rate and can achieve positive pressure atmosphere protection at the end of the process, with a pressure of up to 3 bar. The product features an open/close design with an upper and lower chamber cover, and the cover design on the chamber top meets ergonomic requirements. The system is equipped with a closed-loop water cooler for rapid cooling. The equipment can optionally perform formic acid cleaning before the process.

Standard/Optional

Chamber Quantity: 1; Temperature Control: Independent temperature control by upper and lower pressure heads; Chamber Opening: Equipped with an ergonomic chamber lid opening design; System Operation: Recirculating water cooling, equipped with a closed-loop water cooling heat exchanger. Optional: Pressure protection; Formic acid atmosphere.