Feature Introduction
Observation System: The chamber features a visible window, allowing for real-time observation of the welding process.
Heating System: Equipped with 6 sets (H6) of heating systems, operating simultaneously under vacuum conditions.
Vacuum System: Equipped with a large vacuum pump, capable of rapidly achieving a vacuum environment below 10 Pa in the furnace cavity.
Cooling System: The equipment is equipped with a water cooling system, ensuring rapid temperature reduction in high-temperature vacuum conditions.
Software System: Programmable temperature rise and fall control, capable of setting temperature rise and fall curves according to process requirements. Each curve can be automatically generated, edited, modified, and stored, etc.
Control System: Software is modularly designed, allowing for independent settings of process curves, vacuum extraction, atmosphere, cooling, etc., and can integrate production processes for one-touch operation.
Atmosphere System: Equipment achieves weld-free welding, capable of filling with N2/H2 mixed gases, HCOOH, N2, etc. for reduction or protective purposes, ensuring weld void rate below 1%; H2 function is optional.
Data Recording System: Features continuous real-time monitoring and data recording capabilities, including software curve recording, temperature control curve saving, process parameter storage, equipment parameter recording, and retrieval.
Protective Systems: Eight safety monitoring and protection designs for system security states (welding part over-temperature protection, whole machine temperature safety protection, low or high-pressure alarm protection, water pressure protection, safe operation protection, cooling water path protection during welding, level protection, power failure protection).
Product Features
Application Fields: IGBT Modules, MEMS Packaging, LED Packaging, Automotive Lighting, High-Power Semiconductor Devices, Optoelectronic Packaging, Sealed Packaging, Microwave Device Packaging, Microelectronic Production Lines for Various Products.
A. Vacuum Level: Below 10Pa; real-time display of the cavity vacuum level, with programmable control and adjustment capabilities.
B. Vacuum Extraction Rate: 50 m³/h
C. Process腔Body Pressure: 10-1000 Pa
D、Heating plate spacer load-bearing: Single layer load-bearing ≥ 20kg
E. Rapid Cooling Rate: The chamber is equipped with independent water-cooling and gas-cooling systems, allowing for quick cooling of welded components.
Low空洞率 welding quality: Ensure that the welding area achieves less than 1% void rate after welding.
G. Meets high-quality welding technology requirements for high-temperature and vacuum environments, including gold-tin brazing strips, high-lead solder, and lead-free solder paste.
H, High productivity: Actual welding area per layer is 500*300mm, with multiple layers working simultaneously to achieve mass production of devices.
