Function Description

The RS330 vacuum reflow soldering machine is the fifth generation of vacuum reflow soldering equipment launched by Comrade Technology. A compact vacuum reflow soldering (eutectic furnace) machine designed for small batch production, R&D design, and functional material testing applications. It meets the requirement for heating under vacuum, nitrogen, and reducing atmosphere (formic acid) conditions to achieve void-free solder joints, fully satisfying the R&D department's needs for testing and small batch production. It can reduce the void range of the焊接 area to below 3%. It can be used for various solder paste processes, as well as for soldering without flux (solder strips), utilizing inert shielding gas nitrogen, or formic acid and nitrogen-hydrogen mixed gas for reducing applications.

RS330 Software Control System, easy to operate, capable of connecting control equipment and setting various welding process curves, with the ability to adjust, modify, store, and retrieve according to different processes; the software includes an analysis function, which can analyze process curves to determine heating, holding temperature, and cooling information. The software control system automatically records welding processes and temperature control/measurement curves in real-time, ensuring traceability of the device's process.

The RS330 vacuum reflow soldering machine is primarily designed for high-demand welding fields, such as industrial-grade high-reliability products, where even nitrogen protection or gas-phase welding cannot meet the reliability requirements of the products. Fields like material testing, chip packaging, electrical equipment, automotive products, train control, aerospace, and aviation systems, which demand high reliability in circuit welding, must eliminate or reduce voids and oxidation in welding materials. To effectively lower void rates and minimize oxidation on pads or component leads, a vacuum reflow soldering machine is the ideal choice. To achieve high-quality welding, a vacuum reflow soldering machine must be used. This is a process innovation by welding experts from Germany, Japan, the United States, and other countries in various fields.

Industry Applications: The RS330 Vacuum Reflow Soldering Machine is an ideal choice for R&D, process development, material testing, and device packaging testing. It is perfectly suited for high-end research and production in various enterprises, research institutes, universities, and aerospace fields.

Application Fields: Primarily used for defect-free welding and appropriate fluxless welding on components like chips and substrates, casings, and lids, such as IGBT encapsulation, laser diode packaging processes, optical communication device welding, hybrid integrated circuit packaging, casing and lid encapsulation, MEMS, and vacuum encapsulation, as well as solder paste processes.

The vacuum reflow soldering machine has now become an essential equipment for various enterprises, aviation, aerospace, and high-end manufacturing in developed countries like Europe and America, and it has been widely applied in fields such as chip packaging and electronic welding.

Product Features
Welding under a true vacuum environment. Vacuum level up to 10-1 Pa. (equipped with mechanical vacuum pump)

2. Low-activity flux welding environment.

3. Professional software control for an excellent operational experience.

4. A programmable temperature control system with up to 40 stages for the industry, capable of setting optimal process curves.

5. Temperature settings are adjustable, allowing for a process that closely matches the welding material's工艺 curve.

6. Cooling Technology: Utilizes nitrogen cooling + water cooling for rapid temperature reduction (standard configuration). Can also be used individually with water cooling or nitrogen cooling, effectively reducing nitrogen consumption.

7. Online temperature measurement function. Achieves uniformity measurement of the welding area temperature. Provides expert-level support for process adjustment.

8. Nitrogen or other inert gases, meeting the welding requirements of special processes.

9. Temperature of 450℃ (higher options available), meets all soft soldering process requirements.

10. Meets the requirement for simultaneous heating of both upper and lower greenhouses.

Unique Advantages

1. Locking Method: Door automatically retracts via program

2. Heating tube installation: Distributed at 90 degrees at the bottom and top, ensuring uniform temperature distribution, especially at the four edges of the heating plate.

3. The heating tube comes with a quartz sleeve, ensuring that replacing the heating tube does not affect the vacuum of the furnace chamber, making it convenient and quick.

4. Special-designed brackets ensure the heating tube is centrally positioned within the quartz tube, effectively extending its lifespan.

5. The heating tube features a high-temperature coating on the back, enhancing heat utilization efficiency.

6. The vacuum chamber is precision machined as a single unit using CNC technology, minimizing the risk of welding defects, and boasts a vacuum stability of over 10 years.

7. The vacuum door automatic locking device is precision-machined as a CNC integrated unit, effectively enhancing the stability of micro-positive pressure and suitable for long-term use.

8. The vacuum cavity cooling pipeline is precision-machined as a single unit by CNC, eliminating the risk of leakage from the welding of the vacuum cavity cold water pipes.

9. The vacuum cavity is precision-engineered with special materials, combined with 12 years of vacuum design and process expertise, ensuring the vacuum oil pump achieves a vacuum level of 6*10^-1 Pa for the dry vacuum pump at 1.3 Pa.