Feature Introduction

The RS series vacuum reflow soldering machines are the third generation of compact vacuum reflow soldering equipment launched by Comrade Technology. Designed for small batch production, R&D design, and functional material testing applications, the RS series vacuum reflow soldering machines heat in a vacuum environment to achieve void-free solder joints, fully meeting the R&D department's requirements for testing and small batch production. The RS series vacuum reflow soldering can reduce the void range of the焊接 area to 2%, compared to the 20%~30% range of conventional reflow soldering. The RS series vacuum reflow soldering can be used for soldering without flux, achieving void-free joints, and can accommodate various atmospheres using different gases (N2, N2/H2, 95%/5%). The RS series vacuum reflow soldering can utilize lead-free solder paste or solder tape processes, as well as lead-free soldering without flux. The RS series vacuum reflow soldering software control system is user-friendly, allowing direct control of the equipment and setting various welding process curves, which can be modified and created based on different processes.

The RS series vacuum reflow soldering machines are primarily designed for high-demand welding applications, such as industrial-grade high-reliability products, where even nitrogen protection or gas-phase welding cannot meet the reliability requirements of the products. This includes areas like material testing, chip packaging, electrical equipment, automotive products, train control systems, aerospace, and aviation systems, which have stringent requirements for high circuit reliability. To eliminate or reduce voids and oxidation in welding materials, vacuum reflow soldering machines are the ideal choice. To achieve high-quality焊接, vacuum reflow soldering machines must be employed. This is an innovative process adopted by welding experts from Germany, Japan, the United States, and other countries across various fields.

Industry Applications: The RS series vacuum reflow soldering machines are an ideal choice for R&D, process development, material testing, and component encapsulation testing. They are perfect for advanced research and production needs in various enterprises, research institutions, universities, and aerospace industries.

Application Fields: Primarily used for defect-free welding and appropriate fluxless welding on components such as chips and substrates, casings and lids, including IGBT encapsulation, solder paste processes, laser diode packaging, hybrid integrated circuit packaging, casing and lid packaging, MEMS, and vacuum packaging.

The vacuum reflow soldering machine has now become an essential piece of equipment for various enterprises, as well as for high-end manufacturing in industries such as aviation and aerospace, in developed countries like Europe and America. It is also widely used in fields such as chip packaging and electronic welding.

Product Features
Welding under a true vacuum environment. Vacuum up to 10-3 mbar. (10-6 mbar optional)

2. Soldering environment with low-activity flux.

3. Professional software control for an excellent operational experience.

4. Programmable temperature control system with up to 40 segments for the industry, capable of setting optimal process curves.

5. Temperature settings can be adjusted to achieve a process that is closer to the welding material's process curve.

6. Water-cooling technology, achieving rapid cooling effect (standard configuration).

7. Online temperature measurement feature. Achieves uniformity measurement of the welding area temperature. Provides expert-level support for process calibration.

8. Nitrogen or other inert gases, to meet the welding requirements of special processes.

9. Temperature of 450℃ (higher available), meets all soft soldering process requirements.

10. Meets the requirement of simultaneous heating for both upper and lower greenhouses.

【Standard Configuration】

1. One main unit 2. One industrial-grade control computer 3. One set of temperature control software 4. One set of temperature controller 5. One set of pressure controller 6. One set of inert gas or nitrogen control valve

Optional Accessories

1. Corrosion-resistant diaphragm pump, vacuum 10 mbar 2. Rotating blade pump, for vacuum 10-3 mbar 3. Turbomolecular pump system, for vacuum 10-6 mbar 4. High-temperature module (up to 500 degrees)