Feature Introduction
The RS series vacuum reflow soldering machines are the third generation of compact vacuum reflow soldering equipment launched by Comrade Technology. Specifically designed for small batch production, R&D design, and functional material testing applications. The RS series vacuum reflow soldering machines heat in a vacuum environment to achieve void-free solder joints, fully meeting the R&D department's requirements for testing and small batch production. The RS series can reduce the void range of the焊接area to 2%, whereas conventional reflow soldering ranges from 20% to 30%. These machines are suitable for soldering without flux, achieving void-free joints, and can be used with various atmospheres such as N2, N2/H2, and 95%/5% gases. The RS series can utilize lead-free solder paste or tape processes, as well as soldering without flux. The RS series vacuum reflow soldering machine's software control system is user-friendly, allowing direct control of the equipment and setting various welding process curves, which can be modified and created based on different processes.
The RS series vacuum reflow soldering machines are primarily designed for high-reliability welding applications, such as industrial-grade products and products requiring nitrogen protection or gas-phase welding, which cannot meet the reliability requirements. They are ideal for circuit welding in fields like material testing, chip packaging, electrical equipment, automotive products, train control, aerospace, and aviation systems, where high reliability is critical, and to eliminate or reduce voids and oxidation in welding materials. To effectively reduce void rates and minimize oxidation on pads or component leads, a vacuum reflow soldering machine is the ideal choice. For achieving high-quality welding, opt for a vacuum reflow soldering machine. This is a process innovation by welding experts from Germany, Japan, the United States, and other countries.
Industry Applications: The RS series vacuum reflow soldering machines are the ideal choice for R&D, process development, material testing, and component encapsulation testing. They are perfect for enterprises, research institutions, universities, and aerospace industries in their research and production needs.
Application Fields: Primarily used for defect-free welding and appropriate fluxless welding in chip and substrate, casing and cover, etc., such as IGBT encapsulation, solder paste process, laser diode packaging, hybrid integrated circuit encapsulation, casing cover encapsulation, MEMS, and vacuum encapsulation.
Vacuum reflow soldering has now become an essential equipment for businesses in developed countries like Europe and the United States, as well as in the aerospace industry, and it is widely used in chip packaging and electronic welding fields.
Product Features
Welding under a true vacuum environment. Vacuum level up to 10-3 mba. (Optional: 10-6 mba)
2. Soldering environment for low-activity flux.
3. Professional software control for an enhanced operational experience.
4. A programmable temperature control system with up to 40 segments for the industry, allowing for optimal process curves.
5. The adjustable temperature setting allows for a process that more closely matches the welding material's process curve.
6. Water-cooling technology, achieving rapid cooling effect (standard).
7. Online temperature measurement feature. Achieves uniformity measurement of the welding area temperature. Provides expert-level support for process adjustment.
8. Nitrogen or other inert gases, to meet the welding requirements of special processes.
9. Temperature can be up to 450°C (higher options available), meeting all soft soldering process requirements.
10. Meets the requirement of simultaneous heating for both upper and lower greenhouses.
[Standard Configuration]
1. One main unit 2. One industrial-grade control computer 3. One set of temperature control software 4. One set of temperature controller 5. One set of pressure controller 6. One set of inert gas or nitrogen control valve
Optional Accessories
1. Corrosion-resistant diaphragm pump, vacuum 10 mbar 2. Rotating vane pump for vacuum levels of 10-3 mbar 3. Turbomolecular pump system for vacuum levels of 10-6 mbar 4. High-temperature module (up to 500°C)
