1 Vacuum Chamber:Utilizing vertical, U-shaped, and front-opening structures, the front-opening design facilitates the handling of samples and the daily maintenance of the vacuum chamber.

2 Source of Evaporation:With 6 sets of evaporation sources (metal evaporation sources)2Group, Organic Evaporation Source4Available in sets, or can be customized according to specific requirements.

3 Vacuum System:Utilizing a "molecular pump + mechanical pump" vacuum system.High vacuum plate valve

4 Vacuum Measurement: "Two Low and One High" (two resistive gauges for low vacuum, one ion gauge for high vacuum) digital composite vacuum gauge, measurement range from5-5×120mm，Heating Temperature: 300±1℃，RPM<span style="font-family:"line-height:150%;font-size:12pt">0～20r/minContinuous adjustment; the loading platform is made of hard aluminum with spring clip fixtures, the substrate is placed directly above the evaporation source, the fixture is designed according to the substrate size for easy sample fixation, equipped with a substrate platform guard.

6 Film Thickness Gauge:The thickness gauge water-cooled probe is mounted near the wafer stage on the wafer holder. The thickness gauge is used for real-time monitoring of deposition rate and final thickness, with an accuracy of ±0.1A (0.01nm). It features interlock functionality with the power supply. During operation, if the deposition reaches the set thickness, the power supply can be automatically cut off to stop the deposition.；

7 Control System:Complete SetControl system utilizesPLC+TouchscreenControlFeatures include both automatic and manual modes, allowing input of parameters on a touch screen for exploring coating process parameters.