Direct Electroplated Metalized Substrate (DPC)
DPC (Direct Plating Copper) is a fundamental electronic material that achieves metallization on ceramic surfaces through magnetic sputtering pre-plating and is based on electroplating technology, enabling thermal and electrical separation.
Advantages
1. Higher thermal conductivity, a more matched coefficient of thermal expansion.
2. Stronger and lower resistance metal film layer.
3. Excellent weldability and high operating temperature.
4. Good insulation properties.
5. Customizable conductive layer thickness within 0.1mm to 1mm.
6. Free from organic content, with resistance to cosmic rays, high reliability in aerospace applications, and long service life.
7. High-density assembly line/spacing (L/S) resolution up to 20um, enabling integrated miniaturization of equipment.
8. Low high-frequency loss, suitable for high-frequency circuits.
9. Copper-plated sealed holes, high reliability.
10. 3D Substrate, 3D Wiring.
Application Fields: Automotive Electronics, Industrial Electrical Control, Communication Industry, LED Packaging, Gesture Recognition, Face Recognition, TEC Refrigeration, MEMS Packaging. RF Power Amplifier Packaging, Optical Communication Chip Packaging, Aviation, LED Flashlights, Flash LED, Laser Radar, Industrial Laser Chip Packaging, Infrared, 3D Sensing Camera, Vehicle LED, UV LED.
Technical Capabilities
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Copper Clad Ceramic Substrate (DBC)
Copper-clad ceramic, also known as copper-clad ceramic substrate, is an electronic base material made by directly sintering copper foil onto the ceramic surface using DBC (Direct Bond Copper) technology.
Advantages
1. High mechanical stress resistance, stable shape.
2. High strength, high thermal conductivity, and high insulating properties.
3. Strong bonding, corrosion-resistant.
4. Excellent thermal cycling performance with up to 50,000 cycles, ensuring high reliability.
5. Structures that can be etched with various patterns, similar to PCB boards (or IMS substrates).
6. Non-toxic and harmless.
7. Operating temperature range: -55℃ to 850℃; thermal expansion coefficient close to silicon, simplifying the production process of power modules.
Application Areas: The downstream applications of DBC ceramic substrates are extensive, including semiconductor coolers, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, and intelligent power components, as well as high-frequency applications.
DBC ceramic substrates are present in various industrial electronic fields, including switch mode power supplies, solid-state relays, automotive electronics, solar panel components, telecommunications-specific switches, receiving systems, and lasers.
Technical Capabilities
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Copper-clad Ceramic Substrate (AMB)
AMB technology is an advancement of DBC technology, a method that utilizes the reactive metal elements in the solder (such as Ti/Ag/Zr/Cu) to bond ceramics with metals, forming a reaction layer on the ceramic that can be wetted by the liquid solder. Compared to traditional products, AMB ceramic substrates achieve bonding through a chemical reaction between the ceramic and reactive metal solder paste at high temperatures, resulting in higher bonding strength and better reliability. They are suitable for connectors or applications requiring high current carrying capacity and excellent heat dissipation.
Advantages
1. Lower CTE (Coefficient of Thermal Expansion)
2. Possibility of a sealed packaging with 0% water absorption
3. Thermal conductivity up to 180 W/m
4. Soldering technology can achieve a copper weight of up to 800 micrometers on thin ceramic substrates.
Application Fields: New Energy Vehicles, Power Motorcycles, Aerospace, and more.
