Full-color LED display chips are solid-state semiconductor devices that convert electrical energy directly into light. The core of an LED is a semiconductor chip, one end connected to a substrate, one end being the negative pole, and the other end connected to the positive pole of the power supply, with the entire chip encapsulated in epoxy resin. The semiconductor chip consists of two parts, one being the p-type semiconductor, where holes dominate, and the other being the n-type semiconductor, primarily composed of electrons.

However, when these two semiconductors are connected, they form a p-n junction. As current flows through the wire to the chip, electrons are recombined with holes in the P-type compound in the P region, emitting photons in the process, which is the principle of an LED. The color of the light is determined by the material forming the p-n junction. The LED chip is the main raw material for LEDs. LEDs primarily rely on the chip for illumination.

LED chips are based on epitaxial chips, which are completed through a series of channels. Epitaxial wafer - Cleaning - Electroplating transparent electrode layer (Indium Tin Oxide,ITO) - Transparent electrode lithography - Etching and stripping - Platform pattern lithography to dry etching and stripping - Annealing - SiO2 deposition - Window pattern lithography - SiO2 CORROOS - Stripping - N-pole pattern lithography to pre-cleaning, coating and stripping, annealing to P-pole graphic printing, coating and stripping, grinding and chips, finished product inspection.