This product is suitable for bonding and fixing in the processing of semiconductor materials such as metal, glass, ceramics, silicon wafers, sapphire, and Si, featuring good fluidity for even application on workpieces. It maintains stable quality and is ideal for high-precision processes like cutting, grinding, and polishing.

This liquid wax grinding polishing is highly efficient, and the product's flatness and crystal uniformity are both well guaranteed. The TTV after bonding can be less than 1um.

Easy to remove wax and clean; can be washed with alcohol and alkaline solvents.

2. Low melting point

High purity.

4. Eco-friendly

5. Concentration, softening point, melt viscosity, hardness, solvent, and other items can be adjusted and customized according to customer requirements.

[Instructions for Use]

Waxing: Apply an appropriate amount of liquid wax, then spin and spread it. After heating the ceramic plate to 100~130 degrees, press and bond.

2. De-waxing: Heating to 100~130°C removes the wax, simply clean with alcohol.