Alumina particles have a narrow particle size distribution, high grinding efficiency, and excellent polishing results. Their grinding efficiency is significantly higher than that of soft abrasive materials like silicon dioxide. The surface finish is superior to that of white fused alumina in polishing, with strong cutting power, quick shine, and the ability to effectively grind away surface imperfections. It can produce a uniform and bright luster, enabling mirror polishing. Therefore, it is commonly used as an abrasive for grinding and polishing.

Features:

This series of nano alumina polishing powders offers stable quality, controllable particle size, and concentrated particle size distribution, featuring the following characteristics:

1. Medium hardness, without scratching the surface being projected.

2. Good suspension, no easy sedimentation, convenient to use.

3. Excellent dispersion, enhancing polishing efficiency and precision.

Application Scope and Parameters

Precision polishing for optical lenses, single-core fiber optic connectors, microcrystalline glass substrates, crystal surfaces, gemstones, glassware, metal products, semiconductor materials, plastics, magnetic tapes, and sanding belts.

This series of products is suitable for chemical mechanical polishing (CMP) processes for semiconductor materials such as silicon wafers, germanium single crystal wafers, gallium arsenide wafers, hard disk glass, sapphire wafers, and silicon carbide wafers. They feature high removal rates, ease of use, and excellent polishing results. The surface roughness of the wafers after polishing can reach below 0.2um, and they also improve the roughness and parallelism of the wafers, with no scratches or polishing haze. While providing high-quality products to customers, our company also reduces processing costs. This series is an excellent choice for replacing imported products.
Properties: This product is a milky colloidal aqueous solution, non-toxic and odorless.
Features
1: High removal rate: Reduces the time required for polishing process, boosts production efficiency, recyclable, with a large dilution ratio.
2: Easy to Use: This polishing fluid is suitable for general polishing processes.
3: Excellent polishing effect: The polished surface has good roughness, no scratches, and no polishing mist.
Application Scope and Parameters
This series is used for polishing single crystal silicon wafers, including as-cut, zone-melted, original silicon wafers with diameters φ76-150mm, as well as doped silicon wafers, both single and double-sided polishing. It is also applicable to polishing processes of other semiconductor materials such as sapphire, germanium, and gallium arsenide wafers. Additionally, it is used for polishing optical crystal materials like lithium niobate.

Note: The above can also be adjusted to different concentrations and particle sizes according to the user's needs.