Specs and Parameters:

The thinning rate on the sapphire material is: 10UM/min

Usage Time: 350-400 hours

Specs: 9B, 13B, 16B machines.

ZF Diamond Grinding Pads are widely used in thinning processes for hard disk substrates, standard optical filter films, K9 glass, ceramics, silicon wafers, and quartz glass materials.

Features:

ZF Diamond Grinding Pad has distinct differences compared to traditional slurry technology:

1. The ZF Diamond Pad utilizes a fixed abrasive grinding product, which offers the advantage of maintaining a high grinding cutting force with consistent stability. The surface quality of the ground products is superior, with low roughness, which can shorten the polishing time by 20%-30%, reduce the generation of chips, and improve yield rate.

2. Easy Operation: Simply stick the ZF grinding pad onto the copper plate, peel it off after use, and replace with a new set.

3. No new equipment required; also saves on copper disc costs.

4. Operational Environment Enhancement: No paste required; only a small amount of coolant is needed, and it can also reduce the cost of wastewater treatment.