This series is produced with formulas from Japan's FUJIMI Co. and the U.S.'s DUPON, suitable for semiconductor materials like silicon wafers, germanium single crystal wafers, gallium arsenide wafers, hard disk glass, sapphire wafers, and silicon carbide wafers. It features high removal rates, ease of use, and excellent polishing effects. After polishing, the surface roughness of the wafer can be reduced to below 0.2um, while also improving the roughness and parallelism of the wafer, and ensuring no scratches or polishing fog. Our company offers high-quality products to users while reducing processing costs, making this series an excellent choice for replacing imported products.

Property: This product is a milky colloidal aqueous solution, non-toxic and odorless.

Features

High removal rate: Reduces the time required for polishing process, improves production efficiency, reusable, with a high dilution ratio.

2: Easy to Use: This polishing fluid is suitable for general polishing processes.

3: Excellent polishing finish: The polished surface has good roughness, no scratches, and no polishing mist.

Application Scope and Parameters

This series is suitable for polishing single-sided and double-sided silicon wafers, including original silicon wafers with a diameter of φ76-150mm and doped silicon wafers, as well as polishing processes for other semiconductor materials such as sapphire, germanium slices, and gallium arsenide slices. Additionally, it is used for polishing optical crystal materials like lithium niobate.