Product Details

Principle
The reaction mechanism during ultraviolet laser processing is achieved through photochemical ablation, which relies on the laser energy to break the bonds between atoms or molecules, turning them into small molecular gases that evaporate.Model Features

Excellent beam quality, resulting in smaller focused spots for ultra-fine marking.

2. Most materials can absorb ultraviolet laser, thus broadening their range of applications.

3. Minimal heat-affected zone, no thermal effect, no issue of material scorching. 4. Fast marking speed, high efficiency, compact size, low power consumption.

Applicable Industries

High-precision marking, cutting, and fine processing for special materials, primarily used for various materials such as glass, LCD screens, textiles, thin ceramic sheets, semiconductor silicon wafers, particles, sapphire, polymer films, and other surface treatments.