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13701314315
The "tombstone" phenomenon often occurs during the reflow soldering process of CHIP components (such as surface mount capacitors and resistors), with smaller components being more susceptible. Particularly in the production of 1005 or smaller 0603 surface mount components, it is challenging to eliminate the "tombstone" occurrence. During the reflow soldering process of surface mount technology, the components can develop defects due to warping, resulting in soldering failures, which people vividly refer to as the "tombstone" phenomenon (i.e., the Manhattan phenomenon).
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