Zhongke Tongzhi Technology Debuts at 2024 CIOE China Optoelectronics Expo, Celebrating the Semiconductors Packaging Technology Event

Beijing Zhongke Tongzhi Technology Co., Ltd. (hereinafter referred to as "Zhongke Tongzhi") is pleased to announce our participation in the 26th China International Optoelectronics Exposition (CIOE), scheduled to take place from September 11th to 13th, 2024, in Shenzhen. As a high-tech enterprise specializing in the research, development, production, and sales of semiconductor equipment, Zhongke Tongzhi will shine at this exhibition, showcasing our new technologies and products in the semiconductor packaging field, contributing to the independent innovation and industrial upgrading of the domestic semiconductor industry.

Since its inception, Zhongke Tongzhi has been dedicated to the research and innovation of semiconductor equipment. Our products include silver sintering equipment, flip-chip die bonder machines, sub-micron placement machines, and high-precision bonding machines.Vacuum Reflow SolderingOur company has multiple series, particularly excelling in the packaging field of silicon carbide power chips. With advanced equipment such as nano-silver sintering printers, nano-silver die bonder machines, nano-silver positive pressure sintering furnaces, and vacuum sintering furnaces, we have developed mature packaging processes for automotive-grade silicon carbide MOSFETs and high-power IGBTs, earning widespread acclaim in the industry.

Throughout our long-standing commitment to providing professional semiconductor equipment and process services to both domestic and international electronics manufacturers, Zhongke Xietong has accumulated extensive experience and developed unique insights and mastery of advanced semiconductor technology and processes. In response to the trend of independent innovation in China's semiconductor industry, we have independently developed and mass-produced a series of specialized semiconductor packaging equipment, including silver sintering equipment for SiC devices, vacuum eutectic furnaces, and vacuum reflow ovens for chip packaging. These equipment have excelled in multiple high-reliability welding applications, successfully replacing imported equipment and now supplied in bulk to major domestic semiconductor enterprises. This has made a positive contribution to promoting independent innovation and development in China's semiconductor industry.

At the 2024 CIOE China Optoelectronics Expo, Zhongke will showcase our latest semiconductor packaging equipment and technological achievements, featuring high-precision and high-stability pick-and-place machines and eutectic furnaces, as well as customized solutions for specific application fields. Our booth numbers are 2B090 and 2B010, conveniently located near Gate 5 of Hall 2 at the Shenzhen International Convention & Exhibition Center, offering a prime location for easy access.

During the exhibition, our technical team at Zhongke Tongzhi will engage in in-depth discussions with industry peers, exploring the latest trends and future prospects in semiconductor packaging technology. We sincerely invite you to visit our Zhongke Tongzhi booth, where we can discuss the new developments in semiconductor technology, share industry insights, and seek collaboration opportunities. Whether you are an industry expert, buyer, or partner, we look forward to meeting you at the Shenzhen Opto Electronics Fair to jointly promote the prosperity and development of the optoelectronics industry.

The 2024 CIOE China Optoelectronics Expo, as the largest, most influential, and authoritative optoelectronics professional exhibition in Asia, will gather top companies and professionals from the global optoelectronics industry. Zhongke's participation is undoubtedly going to add more highlights to this event. We look forward to joining hands with more industry partners to jointly create a bright future for the semiconductor industry.

Exhibition Information Overview：

• Exhibition Name2024 China (Shenzhen) International Optoelectronics Exhibition (CIOE)

• Exhibition DatesSeptember 11th to 13th, 2024

• Exhibition Location1# Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen——Shenzhen International Exhibition & Convention Center

• Booth Number2B090, 2B010 (near Gate 5, Building 2)

Traffic Directions：
You can choose to travel to the venue by subway, bus, taxi, or drive. Specific route planning can be tailored to your personal travel habits and circumstances. During the event, the organizers may also set up free shuttle buses at certain stations to facilitate attendees' access to the venue.

Zhongke Comrade looks forward to meeting you at the 2024 Shenzhen Optoelectronics Fair and witnessing the splendid moment of the optoelectronics industry together! Let's join hands to contribute to the prosperity and development of the semiconductor industry!