Zhongke Comrade Debuts at the 2024 Semiconductor Packaging Technology Exhibition

From November 6th to 8th, 2024, the highly anticipated Semiconductor Packaging Technology Exhibition was grandly held at the Shenzhen Convention and Exhibition Center. The event brought together numerous elite companies from the global semiconductor industry, showcasing new technological achievements and industry trends. Beijing Zhongke Tongzhi Technology Co., Ltd. (hereinafter referred to as "Zhongke Tongzhi"), a leading player in the semiconductor packaging equipment field, was also invited to attend this grand gathering.

Sales Director Wen led the team, accompanied by the sales managers, in making a grand appearance at the exhibition. They showcased a series of self-developed semiconductor equipment and engaged in in-depth discussions and exchanges with exhibitors, industry experts, and potential clients from various regions.

Zhongke Tongzhi is a high-tech enterprise specializing in the research, development, production, and sales of semiconductor equipment. Its product portfolio includes silver sintering equipment, flip-chip bonder machines, sub-micron placement machines, high-precision pick-and-place machines, vacuum crystal growth furnaces, and vacuum reflow soldering systems. Particularly in the encapsulation of silicon carbide power chips, Zhongke Tongzhi boasts unique technology and mature processes.

During the exhibition, Zhongke displayed its advanced equipment, including nano-silver sintering printers, nano-silver die bonding machines, nano-silver positive pressure sintering furnaces, and vacuum sintering furnaces, which are specifically designed for automotive-grade SiC MOSFETs and high-power IGBTs. These devices boast high precision and efficiency, while also meeting stringent requirements for reliability and stability in automotive and high-power applications.

As one of the leading companies in the domestic semiconductor packaging equipment industry, Zhongke Tongzhi has accumulated extensive experience and unique insights through its long-term provision of professional equipment and process services to domestic and international electronic manufacturers. In response to the trend of independent innovation in the domestic semiconductor industry, Zhongke Tongzhi actively participates and takes the initiative, independently developing and mass-producing a series of advanced equipment for the packaging of SiC devices.

Currently, Zhongke Tongzhi's products have been successfully applied in various fields, including chip lead frame welding, LED wafer eutectic welding, IGBT, IPM mass production, and more. In high-reliability welding applications such as pre-formed wafer sintering, MEMS, deep-ultraviolet UVC eutectic, high-power lasers, and chip packages, Zhongke Tongzhi's equipment has, with its exceptional performance and stability, successfully replaced imported equipment and is now supplied in bulk to major semiconductor enterprises in China.

This exhibition not only showcased the new achievements and technical prowess of Zhongke in the semiconductor packaging equipment field, but also provided a solid platform for communication and collaboration with peers at home and abroad. Moving forward, Zhongke will continue to adhere to the corporate spirit of "Innovation, Pragmatism, and Efficiency," consistently enhancing both technical expertise and product quality to offer more superior and efficient semiconductor packaging equipment and process services to clients worldwide.