Bismuthate glass powder, a bismuthate glass powder system using zinc oxide and boric oxide, bismuth oxide system, used as additives in gold paste or silver paste.

• Main IngredientsBismuth oxide glass powder, primarily composed of bismuth oxide (Bi₂O₃)
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• Features
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• Low melting pointBismuth oxide glass powder has a relatively low melting point, generally around 400°C-600°C, which allows it to soften and melt at lower temperatures during the sintering process of gold paste and silver paste. This facilitates the bonding between the gold and silver paste and the substrate, and also reduces the impact on substrates that are not heat-resistant.
• Excellent chemical stabilityNot easily oxidized in the air and resistant to erosion from acidic or alkaline chemicals, ensuring the stability of performance for gold and silver inks under various environmental conditions.
• High insulation propertiesEffectively isolates conductive phases like gold and silver, preventing short circuits, and ensuring electrical properties of gold and silver pastes within the circuit.
• High refractive indexIn applications that require optical performance, it can be paired with materials like gold and silver to meet specific optical requirements.

Role in gold ink and silver ink

• Melting aidDuring the sintering process of gold and silver pastes, boric oxide glass powder can reduce the overall sintering temperature, allowing gold and silver powders to achieve good sintering at relatively lower temperatures, saving energy, improving production efficiency, and avoiding the impact of high temperatures on the properties of gold, silver powders, and the base material.
• Enhanced AdhesionThe product forms an excellent bridge between gold powder, silver powder, and the base material, enhancing the adhesion of gold and silver inks to substrates like ceramics, glass, silicon wafers, etc. This ensures that the gold and silver coatings will not easily peel off from the base material during use.
• Adjust electrical propertiesAdding an appropriate amount of bismuth oxide glass powder can adjust the electrical properties of gold and silver inks after curing, such as resistivity, to better meet the requirements of various electronic components for conductivity.
• Improve rheological propertiesImproves the rheology of gold and silver inks, enhancing their flow and thixotropy during printing or coating processes. This allows for uniform coating on the substrate surface, forming a consistent, even gold or silver film with a smooth finish, thus improving product quality and consistency.

Application Fields

• Electronic Circuit ManufacturingIn the fields of printed circuit boards (PCBs) and integrated circuit (IC) packaging, used for creating gold and silver conductive lines and electrodes, ensuring reliable connections and stable performance of the circuit.
• Solar CellsIn the electrode paste of solar cells, it aids in forming a good ohmic contact between the silver paste and the silicon wafer surface, enhancing the battery's photovoltaic conversion efficiency and stability.
• SensorGold and silver electrodes and conductive circuits for various sensors, ensuring signal transmission and detection accuracy of the sensors.
• Electronics ComponentsIn the manufacturing of electronic components such as capacitors, resistors, and inductors, gold paste and silver paste, as an integral part, play a role in connecting, conducting, and insulating, enhancing the performance and reliability of the components.