Product IntroductionThe full-board dimension rapid measurement machine is based on optical image technology, achieving rapid detection through high-speed cameras and high-precision image processing algorithms.
Product Introduction：
The full board dimension rapid measurement machine is based on optical image technology, achieving fast detection through high-speed cameras and high-precision image processing algorithms. Line scan camera and image stitching technology: By using high-speed line scan cameras to continuously scan PCB boards, combined with high-precision image stitching algorithms, it quickly generates a full-board image and automatically extracts measurement data. It can complete full-size measurements from hundreds to thousands of points within a range of 650×750mm.
One-touch Flash Test TechnologySupports random placement of PCB boards; no need for positioning fixtures. Achieves measurement of 1024 sizes within 3 seconds using a 20-megapixel CMOS sensor and high-resolution lens, with efficiency up to dozens of times that of traditional two-dimensional measuring instruments.
Key Technical Features
Efficiency and automation
Supports simultaneous measurement of multiple PCBs; no manual alignment or fixture positioning required; multiple boards can be freely placed; scanning time takes only 20-90 seconds.
Software automatically generates SPC reports and statistical analyses, supporting CAD drawing import and template matching.
High precision and stability
Measurement accuracy up to ±5μm (repeatability), certain models (such as ZY Technology KC2021) use 00 grade marble bases and linear motors, with a grating scale accuracy of 0.5μm, ensuring long-term stability.
By pixel calibration technology (e.g., VX8300), avoid errors caused by temperature or mechanical wear.
Multi-functional measurement capability
Full-size inspection for PCB/FPC/HDI board dimensions, hole diameter, pad spacing, line width and spacing, and gold finger parameters.
Partial equipment features adjustable height measurement (such as the optional Z-axis moving module for VX8300) or geometric tolerance analysis (like roundness, perpendicularity).
Application Fields
PCB/FPC/HDI board manufacturing: Inspect linewidth, pad size, hole position accuracy, etc., after etching.
Automotive Electronics and Precision Hardware: Multi-size batch inspection of components such as connectors, magnetic materials, springs, etc.
Quality Control and Process Optimization: Optimize process parameters of upstream processes (such as exposure, etching) through SPC analysis reports.
Advantages Summary
Efficiency Enhancement: One unit can replace 15 traditional tridimensional instruments, significantly shortening the testing cycle.
High flexibility: Supports measurement of irregular shapes, no need for positioning fixtures, suitable for small batch and diverse production.
Data intelligence: Automatically generates inspection reports, supports batch tolerance settings and color grading management.
