High-speed precision automated low-table packaging machine

YS-312RKL Fully Automatic Bundling Machine (Low Table)

Power: AC220V, 50/60Hz, 900W

2. Dimensions: L1851mm x W627mm x H1430mm

3. Binding Specifications: Standard Frame Size: Width 650mm × Height 500mm, Frame Dimensions 650*500mm (compatible

Product Width (130~500mm) x Height (60~400mm)

4. Desk Surface Height: 480mm

5. Bundling Speed: 25/band/min

Tension Force: 0-45 kg

7. Binding Tape Specifications: Polypropylene, PP Tape Width 11-12mm, Thickness 0.45-0.55mm

Roll Width: 170mm to 190mm

Inside diameter: 200mm to 210mm, outside diameter: 400mm to 450mm

8. Bonding Method: Hot melt, bottom bonding, bonding surface ≥90%, bonding position deviation ≤2mm.

9. Machine Weight: 185 kg

10. Electrical Configuration:

Button Switch: Siemens APT

Mid-range Relay: Schneider

Microcontroller: Self-manufactured

Ø Motor: MEIWA

Photovoltaic, proximity switches, and other sensors: SODRON, P+F

11. Noise: Noise level in the working environment ≤ 75dB(A)

Environmental Conditions: Humidity ≤ 90%, Temperature 0-40℃

Payment Method: Full payment before shipment.

2. This is the dealer's factory price including 13% VAT, excluding shipping fees.

3. Delivery Time: Shipment within 7 working days upon payment receipt

4. Warranty: 1-year warranty for the motor and circuit board; other parts available for a fee; no free on-site service.

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