Shanghai Yishun International Trade Co., Ltd. branch sells the full range of KONTRON circuit boards, KONTRON modules, and other products.

COM Express Basic Type 6 | Control Creation: Kontron offers a wide range of products for the COM Express basic form factor module (125 x 95 mm), adhering to the Type 6 pin definition. The COM Express basic features Type 6 pin outputs, providing USB 3.0 and additional display output interfaces. This makes it intriguing for cost-effective, high-data transfer applications such as digital signage solutions and industrial vision solutions with high-speed USB 3.0 cameras.

COM Express Basic Type 7 | Creonic: Kontron offers a broad product range for COM Express basic form factor modules (125 x 95 mm), compliant with 7-pin pin definition. COM Express basic features a pin output type of 7, which can support up to 4 10Gbit Ethernet interfaces, making the platform suitable for networking applications.

COM Express Compact: The compact COM Express design has a footprint of just 95 x 95mm, making it an entry-level model for applications transitioning from other small solutions to COM Express, offering full PCI Express, PEG, and DisplayPort.

COMe Mini: The COM Express mini is designed to offer energy-efficient computer modules with high-performance x86 technology, with a footprint only slightly larger than a credit card - just 55 x 84 mm. The ultra-compact控创 COM Express mini module features COM Express Type 10 pin definition.

COMh-caRP Based on the 13th Generation Intel Core Processor (originally codenamed Raptor Lake U/P/H. Offers significantly improved performance over the previous generation, featuring 14 to 24 cores, and is especially suitable for IoT applications with Intel's 13th Generation performance. The new embedded controller ensures enhanced availability, flexibility, and system openness. This module provides essential industrial-grade features, such as support for in-band error correction code (IBECC) memory, Intel Time-Sensitive Computing (Intel TCC), Time-Sensitive Networking (TSN), and an expanded temperature range of -40C to +85C Tjmax. All features are highly suitable for high-performance computing in resource-intensive and high-demand fields such as networking, automation, and measurement, allowing customers to benefit from long-term availability.

The COM-HPC client module is equipped with the 12th generation Intel Core processor, measuring 95x120mm, and is highly suitable for high-performance computing in resource-intensive fields such as networking, automation, and measurement. The COMh-caAP offers an optimized power consumption performance ratio, with a TDP (Thermal Design Power) of 15 to 45W; in multi-threading processing, 14 cores can handle 20 threads. The module also features up to 64GB of DDR5 memory and up to 2.5 Gbit Ethernet, including TSN support. For storage, an integrated NVME SSD with up to 1TB is available. The COM-HPC module also supports Thunderbolt (via USB display and PCIe 5.0).